Non resettable fuses

SMD-FST

www.schurter.com/pg0_2

Fuses

Surface Mount Fuse, 5 x 20 mm, Time-Lag T, L, 250 VAC, Au plating

 

IEC 60127-2 · 250VAC · Time-Lag T

Description

-Directlysolderableonprintedcircuitboards

-L=LowBreakingCapacity

-Forratedcurrent1Ato16A,SMD-SPTisrecommended

Standards

-IEC60127-2/3

-UL248-14

-CSAC22.2no.248.14

Approvals

-VDECertificateNumber:40011522

-ULFileNumber:E41599

Applications

-PrimaryProtectiononSMDPCB

References

PackagingDetails

Weblinks

pdf-datasheet,html-datasheet,GeneralProductInformation,

Approvals,CEdeclarationofconformity,RoHS,CHINA-RoHS,e-Shop,

SCHURTER-Stock-Check,Distributor-Stock-Check,Detailedrequestfor

product

Technical Data

RatedVoltage

250VAC

RatedCurrent

0.05-20A

BreakingCapacity

35A-125A

Characteristic

Time-LagT

Mounting

PCB,SMT

AdmissibleAmbientAirTemp. -55°Cto125°C

ClimaticCategory

55/125/21acc.toIEC60068-1

Material:Housing

Glass

Material:Terminals

Gold-PlatedCopperAlloy

UnitWeight

1.05g

StorageConditions

0°Cto60°C,max.70%r.h.

ProductMarking

,Current,Dielectricstrength,Cha-

racteristic,BreakingCapacity

SolderingMethods

Reflow

Solderability

245°C/3secacc.toIEC60068-2-58,

TestTd

ResistancetoSolderingHeat

260°C/10secacc.toIEC60068-2-58,

TestTd

ResistancetoVibration

acc.toIEC60068-2-6,testFc

LoadHumidityTest

MIL-STD-202,Method103B

0.1xIn@0.85r.H.@85°C

MoistureResistanceTest

MIL-STD-202,Method106E

(50cyclesinatemp./misterchamber)

TerminalStrength

MIL-STD-202,Method211A

Deflectionofboard1mmfor1minute

ThermalShock

MIL-STD-202,Method107D

(200air-to-aircyclesfrom-55to

+125°C)

CaseResistance

acc.toEIA/IS-722,Test4.7

>100M

Ω(betweenleedsandbody)

ResistancetoSolvents

MIL-STD-202,Method215A

Dimensions

20mm

 

10

±0.2

5.5

5.5

9.5

Soldering pads