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V23079-D2008-B301 Datasheet(PDF) 11 Page - Tyco Electronics |
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V23079-D2008-B301 Datasheet(HTML) 11 Page - Tyco Electronics |
11 / 14 page AXICOM Telecom-, Signal and RF Relays P2 V23079 Relay 108-98002 Rev. D All specifications subject to change. Consult Tyco Electronics for latest specifications. 11 of 14 Soldering conditions according IEC 60058-2-58 and IPC/JEDEC J-STD-020B Infrared Soldering: Temperature/Time Profile (Lead and Housing Peak Temperature) 240 °C 180 °C 130 °C 100 °C 20 - 40 sec Full line: typical Dotted line: process limits forced cooling Time (s) Time (s) Infrared Soldering: Temperature/Time Profile (Lead and Housing Peak Temperature) Time (s) Recommended Soldering Conditions Recommended reflow soldering profile Resistance to soldering heat - Reflow profile Vapor Phase Soldering: Temperature/Time Profile (Lead and Housing Peak Temperature) |
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