AXICOM

Telecom-, Signal and RF Relays

P2 V23079 Relay

108-98002 Rev. D

All specifications subject to change. Consult Tyco Electronics for latest specifications.

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Insulation

Standard Version

High dielectric Version

Insulation resistance at 500 Vdc

Dielectric test voltage (1 min)

between coil and contacts (Relay with 1 coil)

between adjacent contact sets

between open contacts

1500 Vrms

1000 Vrms

1000 Vrms

1500 Vrms

1500 Vrms

1500 Vrms

Surge voltage resistance

according to Telcordia TR-NWT-001089 (2 /10 µs)

between coil and contacts (Relay with 1 coil)

between adjacent contact sets

between open contacts

according to FCC 68 (10/160 µs)

between coil and contacts (Relay with 1 coil)

between adjacent contact sets

between open contacts

2500 V

2500 V

2000 V

1500 V

1500 V

1500 V

2500 V

2500 V

2500 V

Insulation according to IEC / EN 60950

Clearance

Creepage distance

Basic insulation

1.3 mm

2.5 mm

High Frequency Data

Capacitance

between coil and contacts

between adjacent contact sets

between open contacts

max. 2 pF

max. 1.5 pF

max. 1 pF

RF Characteristics

Isolation at 100 MHz / 900 MHz

Insertion loss at 100 MHz / 900 MHz

V.S.W.R. at 100 MHz / 900 MHz

- 39.0 dB / - 20.7 dB

- 0.02 dB / - 0.27 dB

1.04 / 1.40

General Data

Operate time at U

3 ms / 4 ms

Reset time (latching) at U

3 ms / 4 ms

Release time without diode in parallel (non-latching), typ. / max.

2 ms / 4 ms

Release time with diode in parallel (non-latching), typ. / max.

4 ms / 6 ms

Bounce time at closing contact, typ. / max.

1 ms / 3 ms

Maximum switching rate without load

50 operations/s

Ambient temperature

-40 °C ... +85 °C

Thermal resistance

< 125 K/W

Maximum permissible coil temperature

125 °C

Vibration resistance (function)

35 G

10 to 1000 Hz

Shock resistance, half sinus, 11 ms

50 G (function)

150 G (damage)

Degree of protection / Environmental protection

immersion cleanable, IP 67 / RT III

Needle flame test

application time 20 s, no burning < 15s

Mounting position

any

Processing information

Ultrasonic cleaning is not recommended

Weight (mass)

max. 2.8 g

Terminal surface

SnCu 0.7

Moisture sensitive level (JEDEC J-STD-020B) - SMD types

MSL 3

Resistance to soldering heat

265 °C / 10 s

All data refers to 23 °C unless otherwise specified.