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HS9-26CLV31RH Datasheet(PDF) 3 Page - Intersil Corporation |
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HS9-26CLV31RH Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 3 page HS-26CLV31RH, HS-26CLV31EH 3 FN4898.3 December 12, 2012 Die Characteristics DIE DIMENSIONS: 96.5 mil x 195 mils x 21 mils (2450 x 4950) INTERFACE MATERIALS: Glassivation: Type: PSG (Phosphorus Silicon Glass) Thickness: 8k Å ±1kÅ Metallization: Bottom: Mo/TiW Thickness: 5800 Å ±1kÅ Top: AlSiCu (Top) Thickness: 10k Å ±1kÅ Substrate: AVLSI1RA Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential (Powered Up): VDD ADDITIONAL INFORMATION: Worst Case Current Density: <2.0 x 105A/cm2 Bond Pad Size: 110µm x 100µm Metallization Mask Layout HS-26CLV31RH, HS-26CLV31EH (14) DO (13) DO (12) ENABLE (11) CO (10) CO AO (2) AO (3) ENABLE (4) BO (5) BO (6) TABLE 1. HS-26CLV31RH, HS-26CLV31EH PAD COORDINATES RELATIVE TO PIN 1 PIN NUMBER PAD NAME X COORDINATES Y COORDINATES 1AIN 0 0 2 A0 0 -570.7 3A0 0 -1483.5 4 ENABLE 0 -2124.8 5B0 0 -2873.5 6 B0 0 -3786.3 7 BIN 0 -4357 8 GND 852.4 -4357 8 GND 1062.4 -4357 9 CIN 1912.8 -4357 10 C0 1912.8 -3786.3 11 C0 1912.8 -2873.5 12 ENABLE 1912.8 -2124.8 13 D0 1912.8 -1483.5 14 D0 1912.8 -570.7 15 DIN 1912.8 0 16 VIN 1062.4 0 16 VIN 852.4 0 NOTE: Dimensions in microns |
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