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74LVTH16374MTD Datasheet(PDF) 1 Page - Fairchild Semiconductor |
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74LVTH16374MTD Datasheet(HTML) 1 Page - Fairchild Semiconductor |
1 / 8 page © 2005 Fairchild Semiconductor Corporation DS012022 www.fairchildsemi.com January 1999 Revised June 2005 74LVT16374 • 74LVTH16374 Low Voltage 16-Bit D-Type Flip-Flop with 3-STATE Outputs General Description The LVT16374 and LVTH16374 contain sixteen non-invert- ing D-type flip-flops with 3-STATE outputs and is intended for bus oriented applications. The device is byte controlled. A buffered clock (CP) and Output Enable (OE) are com- mon to each byte and can be shorted together for full 16-bit operation. The LVTH16374 data inputs include bushold, eliminating the need for external pull-up resistors to hold unused inputs. These flip-flops are designed for low-voltage (3.3V) VCC applications, but with the capability to provide a TTL inter- face to a 5V environment. The LVT16374 and LVTH16374 are fabricated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining a low power dissipation. Features s Input and output interface capability to systems at 5V VCC s Bushold data inputs eliminate the need for external pull-up resistors to hold unused inputs (74LVTH16374), also available without bushold feature (74LVT16374) s Live insertion/extraction permitted s Power Up/Power Down high impedance provides glitch-free bus loading s Outputs source/sink 32 mA/64 mA s Functionally compatible with the 74 series 16374 s Latch-up performance exceeds 500 mA s ESD performance: Human-body model ! 2000V Machine model ! 200V Charged-device model ! 1000V s Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Ordering Code: Note 1: Ordering code “G” indicates Trays. Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Logic Symbol Order Number Package Number Package Description 74LVT16374G (Note 1)(Note 2) BGA54A (Preliminary) 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide 74LVT16374MEA (Note 2) MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 74LVT16374MTD (Note 2) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide 74LVTH16374G (Note 1)(Note 2) BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide 74LVTH16374MEA (Note 2) MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 74LVTH16374MTD (Note 2) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide |
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