© 2005 Fairchild Semiconductor Corporation

DS012022

www.fairchildsemi.com

January 1999

Revised June 2005

74LVT16374 • 74LVTH16374

Low Voltage 16-Bit D-Type Flip-Flop

with 3-STATE Outputs

General Description

The LVT16374 and LVTH16374 contain sixteen non-invert-

ing D-type flip-flops with 3-STATE outputs and is intended

for bus oriented applications. The device is byte controlled.

A buffered clock (CP) and Output Enable (OE) are com-

mon to each byte and can be shorted together for full 16-bit

operation.

The LVTH16374 data inputs include bushold, eliminating

the need for external pull-up resistors to hold unused

inputs.

applications, but with the capability to provide a TTL inter-

face to a 5V environment. The LVT16374 and LVTH16374

are fabricated with an advanced BiCMOS technology to

achieve high speed operation similar to 5V ABT while

maintaining a low power dissipation.

Features

s Input and output interface capability to systems at

s Bushold data inputs eliminate the need for external

pull-up resistors to hold unused inputs (74LVTH16374),

also available without bushold feature (74LVT16374)

s Live insertion/extraction permitted

s Power Up/Power Down high impedance provides

glitch-free bus loading

s Outputs source/sink

32 mA/64 mA

s Functionally compatible with the 74 series 16374

s Latch-up performance exceeds 500 mA

s ESD performance:

Human-body model

! 2000V

Machine model

! 200V

Charged-device model

! 1000V

s Also packaged in plastic Fine-Pitch Ball Grid Array

(FBGA)

Ordering Code:

Note 1: Ordering code “G” indicates Trays.

Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.

Logic Symbol

Order Number

Package Number

Package Description

74LVT16374G

(Note 1)(Note 2)

BGA54A

(Preliminary)

54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide

74LVT16374MEA

(Note 2)

MS48A

48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide

74LVT16374MTD

(Note 2)

MTD48

48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide

74LVTH16374G

(Note 1)(Note 2)

BGA54A

54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide

74LVTH16374MEA

(Note 2)

MS48A

48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide

74LVTH16374MTD

(Note 2)

MTD48

48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide