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TCC-103 Datasheet(PDF) 1 Page - ON Semiconductor

Part # TCC-103
Description  PTIC Control IC
Download  29 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

TCC-103 Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2013
February, 2013 − Rev. 0
1
Publication Order Number:
TCC−103/D
TCC-103
PTIC Control IC
Introduction
ON Semiconductor’s PTIC Controller IC is a three-output high
voltage digital to analog control IC specifically designed to control
and bias ON Semiconductor’s Passive Tunable Integrated Circuits
(PTICs).
These tunable capacitive circuits are intended for use in mobile
phones and dedicated RF tuning applications. The implementation of
ON Semiconductor’s tunable circuits in mobile phones enables
significant improvement in terms of antenna radiated performance.
The tunable capacitors are controlled through a bias voltage ranging
from 2 V to 20 V. The TCC−103 high-voltage PTIC control IC has
been specifically designed to cover this need, providing three
independent high-voltage outputs that control up to three different
tunable PTICs in parallel. The device is fully controlled through a
multi-protocol digital interface.
Features
Controls ON Semiconductor’s PTIC Tunable Capacitors and
RF Tuners
Compliant with Timing Needs of Cellular and Other Wireless System
Requirements
Integrated Boost Converter with 3 Programmable Outputs
(Up To 24 V)
Low Power Consumption
Auto-detection of SPI (30- or 32-bit) or MIPI RFFE Interfaces
(1.2 V or 1.8 V)
Available in WLCSP (Ball and Peripheral Arrays) and for
Stand-alone or Module Integration
Typical Applications
Multi-band, Multi-standard, Advanced and Simple Mobile Phones
Tunable Antenna Matching Networks
Compatible with Closed Loop and Open-loop Antenna Tuner
Applications
http://onsemi.com
Peripheral Bump
CASE TBD
See detailed ordering and shipping information in the package
dimensions section on page 29 of this data sheet.
ORDERING INFORMATION
MARKING DIAGRAMS
RDL Ball Array
CASE TBD
TCC
= Product Code
X
= MIPI ID
A
= Assembly Location
L
= Wafer Lot Code
Y
= Year Code
W
= Week Code
O
= Pin 1 Marker
Peripheral Bump
RDL
TCCX
ALYW
TCCx
ALYW
TCC
= Product Code
x
= MIPI ID
A
= Assembly Location
L
= Wafer Lot Code
Y
= Year Code
W
= Week Code
O
= Pin 1 Marker


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