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DAC1653Q Datasheet(HTML) 8 Page - Integrated Device Technology

Part No. DAC1653Q
Description  Quad 16-bit DAC: 10 Gbps JESD204B interface: up to 1.50
Download  101 Pages
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Maker  IDT [Integrated Device Technology]
Homepage  http://www.idt.com
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DAC1653Q Datasheet(HTML) 8 Page - Integrated Device Technology

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DAC1653Q/DAC1658Q
© IDT 2013. All rights reserved.
Advance data sheet
Rev. 1.03 — 13 May 2013
8 of 101
Integrated Device Technology
DAC1653Q/DAC1658Q
Quad 16-bit DAC: 10 Gbps JESD204B interface; up to 1.50 Gsps
7. Limiting values
8. Thermal characteristics
[1]
In compliance with JEDEC test board; in free air with 64 thermal vias, class 5.
[2]
In free air with 64 thermal vias, class 5.
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDDA(out)
analog output supply
voltage
DAC1658Q: 3.3 V
0.5
+4.6
V
DAC1653Q: 2.5 V or 3.3 V
0.5
+4.6
V
VDDD(1V2)
digital supply voltage
(1.2 V)
0.5
+1.5
V
VDDA(1V2)
analog supply voltage
(1.2 V)
0.5
+1.5
V
VI
input voltage
input pins referenced to GND
0.5
<tbd>
V
VO
output voltage
pins IOUTA_P, IOUTA_N,
IOUTB_P, IOUTB_N, IOUTC_P,
IOUTC_N, IOUTD_P,
IOUTD_N; IO0; IO1; IO2; IO3;
referenced to GND
0.5
+4.6
V
VDDD(IO)
I/O digital supply
voltage
pins SDO, SDIO,SCLK, SCS_N,
RESET_N, JTAG, IO0,
RF_ENABLE/IO1
0.5
2.1
V
VDDD(SO)
differential SYNC
voltage
pins SYNC_AB_P/N and
SYNC_CD_P/N
0.5
2.1
V
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
40
+85
C
Tj
junction temperature
40
+125
C
Table 4.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
JEDEC 4L board
Rth(j-a)
thermal resistance from junction
to ambient
[1] <tbd>
K/W
Rth(j-c)
thermal resistance from junction
to case
[1] <tbd>
K/W
Application board
Rth(j-a)
thermal resistance from junction
to ambient
6 layers
[2] <tbd>
K/W
8 layers
[2] <tbd>
K/W
12 layers
[2] <tbd>
K/W


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