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LMBR180FT1G Datasheet(PDF) 5 Page - Leshan Radio Company |
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LMBR180FT1G Datasheet(HTML) 5 Page - Leshan Radio Company |
5 / 7 page Reel packing 5.Suggested thermal profile for soldering process 1. Storage environment:Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering LMBR120FT1G thru LMBR1200FT1G SOD123-FL 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.7 REEL DIA. (mm) CARTON SIZE (mm) CARTON (PCS) PACKAGE REEL SIZE REEL (PCS) COMPONENT SPACING (mm) BOX (pcs) APPOX. GROSS WEIGHT (kg) INNER BOX (mm) Time maintained above: - Temperature (TL) - Time(tL) 217℃ 60-260sec Peak Temperature(TP) 255 -0/+5℃ Average ramp-up rate(TL to TP) <3℃/sec Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(ts) 150℃ 200℃ 60~120sec Tsmax to TL - Ramp-up Rate <3sec Profile Feature Soldering Condition Time within 5℃ of actual Peak Temperature(TP) 10~30sec Time 25℃ to Peak Temperature Ramp-down Rate <6℃/sec <6minutes |
Similar Part No. - LMBR180FT1G |
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Similar Description - LMBR180FT1G |
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