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LMBR360FT1G Datasheet(PDF) 5 Page - Leshan Radio Company |
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LMBR360FT1G Datasheet(HTML) 5 Page - Leshan Radio Company |
5 / 7 page Reel packing 5.Suggested thermal profile for soldering process 1. Storage environment:Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering LMBR320FT1G thru LMBR3200FT1G SOD123-FL 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.7 REEL DIA. (mm) REEL SIZE REEL (PCS) COMPONENT SPACING (mm) BOX (pcs) INNER BOX (mm) CARTON SIZE (mm) CARTON (PCS) APPOX. GROSS WEIGHT (kg) PACKAGE Tsmax to TL - Ramp-up Rate <3sec Time maintained above: - Temperature (TL) - Time(tL) 217℃ 60-260sec Ramp-down Rate <6℃/sec Peak Temperature(TP) 255 -0/+5℃ Time within 5℃ of actual Peak Temperature(TP) 10~30sec <6minutes Time 25℃ to Peak Temperature Average ramp-up rate(TL to TP) <3℃/sec Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(ts) 150℃ 200℃ 60~120sec Profile Feature Soldering Condition |
Similar Part No. - LMBR360FT1G |
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Similar Description - LMBR360FT1G |
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