LM4871

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SNAS002F – FEBRUARY 2000 – REVISED MAY 2013

APPLICATION INFORMATION

EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATION

The LM4871's exposed-DAP (die attach paddle) package (NGN) provides a low thermal resistance between the

die and the PCB to which the part is mounted and soldered. This allows rapid heat transfer from the die to the

surrounding PCB copper traces, ground plane, and surrounding air. The result is a low voltage audio power

amplifier that produces 2W at

≤ 1% THD with a 4Ω load. This high power is achieved through careful

consideration of necessary thermal design. Failing to optimize thermal design may compromise the LM4871's

high power performance and activate unwanted, though necessary, thermal shutdown protection.

The NGN package must have its DAP soldered to a copper pad on the PCB. The DAP's PCB copper pad is

connected to a large plane of continuous unbroken copper. This plane forms a thermal mass, heat sink, and

radiation area. Place the heat sink area on either outside plane in the case of a two-sided PCB, or on an inner

layer of a board with more than two layers. Connect the DAP copper pad to the inner layer or backside copper

heat sink area with 4(2x2) vias. The via diameter should be 0.012in-0.013in with a 1.27mm pitch. Ensure efficient

thermal conductivity by plating through the vias.

Best thermal performance is achieved with the largest practical heat sink area. If the heatsink and amplifier share

Ω load. Heatsink areas not

resistance. The last two area recommendations apply for 25°C ambient temperature. Increase the area to

compensate for ambient temperatures above 25°C. The LM4871's power de-rating curve in the Typical

Performance Characteristics shows the maximum power dissipation versus temperature. An example PCB layout

for the NGN package is shown in the Demonstration Board Layout section. Further detailed and specific

information concerning PCB layout, fabrication, and mounting an NGN (WSON) package is available from TI's

Package Engineering Group under application note AN-1187 (Literature Number SNOA401).

PCB LAYOUT AND SUPPLY REGULATION CONSIDERATIONS FOR DRIVING 3

Ω AND 4Ω

LOADS

Power dissipated by a load is a function of the voltage swing across the load and the load's impedance. As load

impedance decreases, load dissipation becomes increasingly dependant on the interconnect (PCB trace and

wire) resistance between the amplifier output pins and the load's connections. Residual trace resistance causes

a voltage drop, which results in power dissipated in the trace and not in the load as desired. For example, 0.1

Ω

trace resistance reduces the output power dissipated by a 4

Ω load from 2.0W to 1.95W. This problem of

decreased load dissipation is exacerbated as load impedance decreases. Therefore, to maintain the highest load

dissipation and widest output voltage swing, PCB traces that connect the output pins to a load must be as wide

as possible.

Poor power supply regulation adversely affects maximum output power. A poorly regulated supply's output

voltage decreases with increasing load current. Reduced supply voltage causes decreased headroom, output

signal clipping, and reduced output power. Even with tightly regulated supplies, trace resistance creates the

same effects as poor supply regulation. Therefore, making the power supply traces as wide as possible helps

maintain full output voltage swing.

BRIDGE CONFIGURATION EXPLANATION

As shown in Figure 3, the LM4871 has two operational amplifiers internally, allowing for a few different amplifier

configurations. The first amplifier's gain is externally configurable; the second amplifier is internally fixed in a

while the second amplifier's gain is fixed by the two internal 40k

Ω resistors. Figure 3 shows that the output of

amplifier one serves as the input to amplifier two, which results in both amplifiers producing signals identical in

magnitude, but 180° out of phase. Consequently, the differential gain for the IC is

(1)

By driving the load differentially through outputs Vo1 and Vo2, an amplifier configuration commonly referred to as

“bridged mode” is established. Bridged mode operation is different from the classical single-ended amplifier

configuration where one side of its load is connected to ground.

Copyright © 2000–2013, Texas Instruments Incorporated

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