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A3977SED-T Datasheet(PDF) 10 Page - Allegro MicroSystems |
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A3977SED-T Datasheet(HTML) 10 Page - Allegro MicroSystems |
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10 / 19 page  Microstepping DMOS Driver with Translator A3977 10 Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com Layout. The printed wiring board should use a heavy ground plane. For optimum electrical and thermal performance, the driver should be soldered directly onto the board. The load supply terminal, VBB, should be decoupled with an electrolytic capacitor (>47 μF is recommended) placed as close to the device as possible. To avoid problems due to capacitive coupling of the high dv/dt switching transients, route the bridge-output traces away from the sensitive logic-input traces. Always drive the logic inputs with a low source impedance to in- crease noise immunity. Grounding. A star ground system located close to the driver is recommended. The 44-lead PLCC has the analog ground and the power ground internally bonded to the power tabs of the package (leads 44, 1, 2, 11 – 13, 22 – 24, and 33 – 35). On the 28-lead TSSOP package, the analog ground (lead 7) and the power ground (lead 21) must be con- nected together externally. The copper ground plane located under the exposed thermal pad is typically used as the star ground. Current Sensing. To minimize inaccuracies caused by ground-trace IR drops in sensing the output current level, the current-sense resistor (RS) should have an independent ground return to the star ground of the device. This path should be as short as possible. For low-value sense resis- tors the IR drops in the printed wiring board sense resistor’s traces can be significant and should be taken into account. The use of sockets should be avoided as they can introduce variation in RS due to their contact resistance. Allegro MicroSystems recommends a value of RS given by RS = 0.5/ITRIPmax Thermal Protection. Circuitry turns off all drivers when the junction temperature reaches 165°C, typically. It is intended only to protect the device from failures due to excessive junction temperatures and should not imply that output short circuits are permitted. Thermal shutdown has a hysteresis of approximately 15°C. Applications Information |
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