Electronic Components Datasheet Search |
|
BD3574HFP Datasheet(PDF) 7 Page - Rohm |
|
BD3574HFP Datasheet(HTML) 7 Page - Rohm |
7 / 10 page Technical Note 7/9 BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP www.rohm.com 2011.03 - Rev.B © 2011 ROHM Co., Ltd. All rights reserved. The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate) voltage to input pins. Fig. 26 Example of a Simple Monolithic IC Architecture 8) Ground wiring patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external parts, either. 9) SW Pin Do not apply the voltage to SW pin when the VCC is not applied. And when the VCC is applied, the voltage of SW pin must not exceed VCC. 10) Thermal shutdown circuit (TSD) This IC incorporates a built-in thermal shutdown circuit for the protection from thermal destruction. The IC should be used within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power dissipation limits, the attendant rise in the chip's temperature Tj will trigger the thermal shutdown circuit to turn off all output power elements. The circuit automatically resets once the chip's temperature Tj drops. The thermal shutdown circuit operates if the IC is under conditions in express of the absolute maximum ratings. Never design sets on the premise of using the thermal shutdown circuit. (See Fig. 8) 11) Overcurrent protection circuit (OCP) The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics to temperatures. (See Fig. 3) GND N P NN P+ P+ Parasitic element or transistor P substr t (Pin B) C B E Transistor (NPN) (Pin A) GND N P N N P+ P+ Resistor Parasitic element P Parasitic elements (Pin A) Parasitic element or transistor (Pin B) GND C B E |
Similar Part No. - BD3574HFP |
|
Similar Description - BD3574HFP |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |