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FDC604P Datasheet(HTML) 2 Page - Fairchild Semiconductor

Part No. FDC604P
Description  P-Channel 1.8V Specified PowerTrench MOSFET
Download  8 Pages
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Maker  FAIRCHILD [Fairchild Semiconductor]
Homepage  http://www.fairchildsemi.com
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FDC604P Datasheet(HTML) 2 Page - Fairchild Semiconductor

   
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FDC604P Rev B(W)
Electrical Characteristics
T
A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ Max Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
VGS = 0 V, ID = –250
µA
–20
V
∆BVDSS
===∆TJ
Breakdown Voltage Temperature
Coefficient
ID = –250
µA,Referenced to 25°C
–12
mV/
°C
IDSS
Zero Gate Voltage Drain Current
VDS = –16 V,
VGS = 0 V
–1
µA
IGSSF
Gate–Body Leakage, Forward
VGS = 8 V,
VDS = 0 V
100
nA
IGSSR
Gate–Body Leakage, Reverse
VGS = –8 V
VDS = 0 V
–100
nA
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = –250
µA
–0.4
–0.7
–1.5
V
∆VGS(th)
===∆TJ
Gate Threshold Voltage
Temperature Coefficient
ID = –250
µA,Referenced to 25°C
3
mV/
°C
RDS(on)
Static Drain–Source
On–Resistance
VGS = –4.5 V,
ID = –5.5 A
VGS = –2.5 V,
ID = –4.8 A
VGS = –1.8 V,
ID = –4.0 A
0.024
0.030
0.042
0.033
0.043
0.060
ID(on)
On–State Drain Current
VGS = –4.5 V,
VDS = –5 V
–20
A
gFS
Forward Transconductance
VDS = –5 V,
ID = –3.5 A
23
S
Dynamic Characteristics
Ciss
Input Capacitance
1926
pF
Coss
Output Capacitance
530
pF
Crss
Reverse Transfer Capacitance
VDS = –10 V,
V GS = 0 V,
f = 1.0 MHz
185
pF
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
13
23
ns
tr
Turn–On Rise Time
11
20
ns
td(off)
Turn–Off Delay Time
90
144
ns
tf
Turn–Off Fall Time
VDD = –10 V,
ID = –1 A,
VGS = –4.5 V,
RGEN = 6
45
72
ns
Qg
Total Gate Charge
19
30
nC
Qgs
Gate–Source Charge
4
nC
Qgd
Gate–Drain Charge
VDS = –10 V,
ID = –3.5 A,
VGS = –4.5 V
7.5
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
–1.3
A
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V,
IS = –1.3 A (Note 2)
–0.7
–1.2
V
Notes:
1. R
θJA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain
pins. R
θJC is guaranteed by design while RθCA is determined by the user's board design.
a. 78°C/W when mounted on a 1in
2 pad of 2oz copper on FR-4 board.
b. 156°C/W when mounted on a minimum pad.
2. Pulse Test: Pulse Width
≤=300 µs, Duty Cycle ≤=2.0%


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