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AD9683-250EBZ Datasheet(PDF) 10 Page - Analog Devices |
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AD9683-250EBZ Datasheet(HTML) 10 Page - Analog Devices |
10 / 44 page AD9683 Data Sheet Rev. 0 | Page 10 of 44 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Rating Electrical AVDD to AGND −0.3 V to +2.0 V DRVDD to DRGND −0.3 V to +2.0 V DVDD to DGND −0.3 V to +2.0 V VIN+, VIN− to AGND −0.3 V to AVDD + 0.2 V CLK+, CLK− to AGND −0.3 V to AVDD + 0.2 V RFCLK to AGND −0.3 V to AVDD + 0.2 V VCM to AGND −0.3 V to AVDD + 0.2 V CS, PDWN to DGND −0.3 V to DVDD + 0.3 V SCLK to DGND −0.3 V to DVDD + 0.3 V SDIO to DGND −0.3 V to DVDD + 0.3 V RST to DGND −0.3 V to DVDD + 0.3 V FD to DGND −0.3 V to DVDD + 0.3 V SERDOUT0+, SERDOUT0− to AGND −0.3 V to DRVDD + 0.3 V SYNCINB+, SYNCINB− to DGND −0.3 V to DVDD + 0.3 V SYSREF+, SYSREF− to AGND −0.3 V to AVDD + 0.3 V Environmental Operating Temperature Range (Ambient) −40°C to +85°C Maximum Junction Temperature Under Bias 150°C Storage Temperature Range (Ambient) −65°C to +125°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL CHARACTERISTICS The exposed pad must be soldered to the ground plane of the LFCSP package. This increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 7. Thermal Resistance PackageType Airflow Velocity (m/sec) θJA1,2 θJC1,3,4 θJB1,4,5 Unit 32-Lead LFCSP 5 mm × 5 mm (CP-32-12) 0 37.1 3.1 20.7 °C/W 1.0 32.4 N/A N/A °C/W 2.5 29.1 N/A N/A °C/W 1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board. 2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per MIL-STD-883, Method 1012.1. 4 N/A = not applicable. 5 Per JEDEC JESD51-8 (still air). Typical θJA is specified for a 4-layer printed circuit board (PCB) with a solid ground plane. As shown in Table 7, airflow increases heat dissipation, which reduces θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces the θJA. ESD CAUTION |
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