Electronic Components Datasheet Search |
|
HSP061-4M10 Datasheet(PDF) 7 Page - STMicroelectronics |
|
HSP061-4M10 Datasheet(HTML) 7 Page - STMicroelectronics |
7 / 11 page HSP061-4M10 Recommendation on PCB assembly Doc ID 023716 Rev 2 7/11 4 Recommendation on PCB assembly Figure 12. Recommended stencil window position 4.1 Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. Stencil window Footprint Copper Thickness: 100 µm 200 µm 190 µm 15 µm 15 µm 5 µm 5 µm 15 µm 15 µm 400 µm 380 µm 10 µm 10 µm |
Similar Part No. - HSP061-4M10 |
|
Similar Description - HSP061-4M10 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |