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FDN340P Datasheet(HTML) 2 Page - Fairchild Semiconductor

Part No. FDN340P
Description  Single P-Channel, Logic Level, PowerTrench MOSFET
Download  8 Pages
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Maker  FAIRCHILD [Fairchild Semiconductor]
Homepage  http://www.fairchildsemi.com
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FDN340P Datasheet(HTML) 2 Page - Fairchild Semiconductor

   
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FDN340P Rev C (W)
Electrical Characteristics
T
A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
VGS = 0 V, ID = –250
µA
–20
V
∆BVDSS
∆TJ
Breakdown Voltage Temperature
Coefficient
ID = –250
µA,Referenced to 25°C
–15
mV/
°C
VDS = –16 V,
VGS = 0 V
–1
µA
IDSS
Zero Gate Voltage Drain Current
TJ=55
°C
–10
IGSSF
Gate–Body Leakage, Forward
VGS = 8 V,
VDS = 0 V
100
nA
IGSSR
Gate–Body Leakage, Reverse
VGS = –8 V
VDS = 0 V
–100
nA
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = –250
µA
–0.4
–0.9
–1.5
V
∆VGS(th)
∆TJ
Gate Threshold Voltage
Temperature Coefficient
ID = –250
µA,Referenced to 25°C
2.7
mV/
°C
VGS = –4.5 V,
ID = –2 A
0.052
0.07
TJ=125
°C
0.075
0.12
VGS= –2.5 V,
ID = –1.7A,
0.078
0.11
RDS(on)
Static Drain–Source
On–Resistance
VGS= –1.8 V,
ID = –1.2 A,
0.21
ID(on)
On–State Drain Current
VGS = –4.5 V,
VDS = –5 V
–5
A
gFS
Forward Transconductance
VDS = –4.5 V,
ID = –2 A
8
S
Dynamic Characteristics
Ciss
Input Capacitance
600
pF
Coss
Output Capacitance
175
pF
Crss
Reverse Transfer Capacitance
VDS = –10 V,
V GS = 0 V,
f = 1.0 MHz
80
pF
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
6
12
ns
tr
Turn–On Rise Time
9
18
ns
td(off)
Turn–Off Delay Time
31
50
ns
tf
Turn–Off Fall Time
VDD = –5 V,
ID = –0.5 A,
VGS = –4.5 V,
RGEN = 6
26
42
ns
Qg
Total Gate Charge
8
11
nC
Qgs
Gate–Source Charge
1.3
nC
Qgd
Gate–Drain Charge
VDS = –10V,
ID = –2 A,
VGS = –4.5 V
2.2
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
–0.42
A
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V,
IS = –0.42 A (Note )
–0.7
–1.2
V
Notes:
1. RθJAis the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCAis determined by the user's board design.
a. 250°C/W when mounted on a
0.02in
2 pad of 2 oz copper
b. 270°C/W when mounted on a
.001 in
2 pad of 2 oz copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300
µs, Duty Cycle < 2.0%


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