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Vishay BCcomponents

Revision: 13-Mar-12

3

Document Number: 28388

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 2 - Dimensional outline

Table 2

MOUNTING

The capacitors are designed for automatic placement on to

printed-circuit boards.

Optimum dimensions of soldering pads depend amongst

others on soldering method, mounting accuracy, print

layout and/or adjacent components.

For recommended soldering pad dimensions, refer to Fig. 3

and Table 3.

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

soldering pad and on top of the case during processing.

For maximum conditions refer to Fig. 4.

Maximum 2 runs with pause of minimum 30 min between.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

AS

A

GENERAL

PRINCIPLE,

TEMPERATURE

AND

DURATION SHALL BE THE MINIMUM NECESSARY

REQUIRED

TO

ENSURE

GOOD

SOLDERING

CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM

CURVES SHOULD NEVER BE EXCEEDED.

Fig. 3 - Recommended soldering pad dimensions

Table 3

DIMENSIONS in millimeters AND MASS

NOMINAL CASE SIZE

Lx W xH

CASE CODE

Ø D

S

MASS

(g)

4.0 x 4.0 x 5.3

0405

4.5

4.5

5.5

4.0

0.8

1.0

 0.13

5.0 x 5.0 x 5.3

0505

5.5

5.5

5.5

5.0

0.8

1.4

 0.20

6.3 x 6.3 x 5.3

0605

6.8

6.8

5.5

6.3

0.8

2.0

 0.30

8.0 x 8.0 x 6.5

0807

8.6

8.6

6.8

8.0

0.8

2.3

 0.50

8.0 x 8.0 x 10

0810

8.6

8.6

10.5

8.0

1.1

3.1

 1.00

10 x 10 x 10

1010

10.6

10.6

10.5

10.0

1.1

4.7

 1.30

10 x 10 x 14

1014

10.6

10.6

14.3

10.0

1.2

4.5

 1.50

0.4 ± 0.2

W B

S

0.3

max.

W

L

D

RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters

CASE CODE

a

b

c

0405

2.6

1.6

1.0

0505

3.0

1.6

1.4

0605

3.5

1.6

1.9

0807

4.0

1.6

2.1

0810

3.5

2.5

3.0

1010

4.0

2.5

4.0

1014

4.3

2.5

4.0

b

a

c

a