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NCP4304A Datasheet(PDF) 4 Page - ON Semiconductor |
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NCP4304A Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 32 page NCP4304A, NCP4304B http://onsemi.com 4 MAXIMUM RATINGS Symbol Rating Value Unit VCC IC supply voltage −0.3 to 30 V VDRV Driver output voltage −0.3 to 17 V VCS Current sense input dc voltage −4 to 200 V VCsdyn Current sense input dynamic voltage (tpw = 200 ns) −10 to 200 V VTRIG Trigger input voltage −0.3 to 10 V VMin_ton, VMin_toff Min_Ton and Min_Toff input voltage −0.3 to 10 V I_Min_Toff, I_Min_Toff Min_Ton and Min_Toff current −10 to +10 mA VGND−COMP Static voltage difference between GND and COMP pins (internally clamped) −3 to 10 V VGND−COMP_dyn Dynamic voltage difference between GND and COMP pins (tpw = 200 ns) −10 to 10 V ICOMP Current into COMP pin −5 to 5 mA RqJA Thermal Resistance Junction−to−Air, SOIC − A/B versions 180 °C/W RqJA Thermal Resistance Junction−to−Air, DFN − A/B versions, 50 mm2 − 1.0 oz. Copper spreader 180 °C/W RqJA Thermal Resistance Junction−to−Air, DFN − A/B versions, 600 mm2 − 1.0 oz. Copper spreader 80 °C/W TJmax Maximum junction temperature 160 °C TSmax Storage Temperature Range −60 to +150 °C TLmax Lead temperature (Soldering, 10 s) 300 °C ESD Capability, Human Body Model except pin VCS – pin 5, HBM ESD Capability on pin 5 is 650 V 2 kV ESD Capability, Machine Model 200 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Pin 1−8: Human Body Model 2000 V per JEDEC Standard JESD22−A114E. Machine Model Method 200 V pre JEDEC Standard JESD22−A115−A 2. This device meets latchup tests defined by JEDEC Standard JESD78. ELECTRICAL CHARACTERISTICS (For typical values TJ = 25°C, for min/max values TJ = −40°C to +125°C, Max TJ = 150°C, VCC = 12 V, Cload = 0 nF, R_min_ton = R_min_toff = 10 kW, Vtrig = 0 V, f_CS = 100 kHz, DC_CS = 50%, VCS_high = 4 V, VCS_low = −1 V unless otherwise noted) Symbol Rating Pin Min Typ Max Unit SUPPLY SECTION VCC_on Turn−on threshold level (VCC going up) 1 9.3 9.9 10.5 V VCC_off Minimum operating voltage after turn−on (VCC going down) 1 8.3 8.9 9.5 V VCC_hyste VCC hysteresis 1 0.6 1.0 1.4 V ICC1_A ICC1_B Internal IC consumption (no output load on pin 8, Fsw = 500 kHz, Ton_min = 500 ns, Toff_min = 620 ns) 1 − − 4.5 4.0 6.6 6.2 mA ICC2_A ICC2_B Internal IC consumption (Cload = 1 nF on pin 8, Fsw = 400 kHz, Ton_min = 500 ns, Toff_min = 620 ns) 1 − − 9.0 6.5 12 9 mA ICC3_A ICC3_B Internal IC consumption (Cload = 10 nF on pin 8, Fsw = 400 kHz, Ton_min = 500 ns, Toff_min = 620 ns) 1 − − 57.0 35.0 80 65 mA ICC_StartUp Startup current consumption (VCC = VCC_on − 0.1 V, no switching at CS pin) 1 − 35 75 mA ICC_Disable_1 Current consumption during disable mode (No switching at CS pin, Vtrig = 5 V) 1 − 45 90 mA ICC_Disable_2 Current consumption during disable mode (CS pin is switching, Fsw = 500 kHz, VCS_high = 4 V, VCS_low =−1 V, Vtrig = 5 V) 1 − 200 330 mA 3. Guaranteed by design. |
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