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FDW2507N Datasheet(HTML) 2 Page - Fairchild Semiconductor

Part No. FDW2507N
Description  Common Drain N-Channel 2.5V specified PowerTrench MOSFET
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Maker  FAIRCHILD [Fairchild Semiconductor]
Homepage  http://www.fairchildsemi.com
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FDW2507N Datasheet(HTML) 2 Page - Fairchild Semiconductor

   
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FDW2507N Rev C2
Electrical Characteristics
T
A
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
VGS = 0 V,
ID = 250
µA
20
V
∆BVDSS
∆T
J
Breakdown Voltage Temperature
Coefficient
ID = 250
µA, Referenced to 25°C
–13
mV/
°C
IDSS
Zero Gate Voltage Drain Current
VDS = 16 V,
VGS = 0 V
1
µA
IGSSF
Gate–Body Leakage, Forward
VGS = 12 V,
VDS = 0 V
100
nA
IGSSR
Gate–Body Leakage, Reverse
VGS = –12 V,
VDS = 0 V
–100
nA
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
VDS = VGS,
ID = 250
µA
0.6
0.8
1.5
V
∆VGS(th)
∆T
J
Gate Threshold Voltage
Temperature Coefficient
ID = 250
µA, Referenced to 25°C
4
mV/
°C
RDS(on)
Static Drain–Source
On–Resistance
VGS = 4.5 V,
ID = 7.5 A
VGS = 2.5 V,
ID = 6.8 A
VGS = 4.5 V, ID = 7.5 A, TJ=125
°C
15
17
20
19
23
27
m
ID(on)
On–State Drain Current
VGS = 4.5 V,
VDS = 5 V
30
A
gFS
Forward Transconductance
VDS = 5 V,
ID = 7.5 A
31
S
Dynamic Characteristics
Ciss
Input Capacitance
2152
pF
Coss
Output Capacitance
512
pF
Crss
Reverse Transfer Capacitance
VDS = 10 V,
V GS = 0 V,
f = 1.0 MHz
263
pF
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
12
22
ns
tr
Turn–On Rise Time
13
23
ns
td(off)
Turn–Off Delay Time
35
56
ns
tf
Turn–Off Fall Time
VDD = 10 V,
ID = 1 A,
VGS = 4.5 V,
RGEN = 6
19
34
ns
Qg
Total Gate Charge
20
28
nC
Qgs
Gate–Source Charge
3
nC
Qgd
Gate–Drain Charge
VDS = 10 V,
ID = 7.5 A,
VGS = 4.5 V
5
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
1.3
A
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V,
IS = 1.3 A
(Note 2)
0.6
1.2
V
trr
Diode Reverse Recovery Time
26
nS
Qrr
Diode Reverse Recovery Charge
IF = 7.5A
diF/dt = 100 A/µs
(Note 2)
21
nC
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a)
77°C/W when
mounted on a 1in
2 pad
of 2 oz copper
b)
114°C/W when mounted
on a minimum pad of 2 oz
copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300
µs, Duty Cycle < 2.0%


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