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AD5271BRMZ-100 Datasheet(PDF) 9 Page - Analog Devices |
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AD5271BRMZ-100 Datasheet(HTML) 9 Page - Analog Devices |
9 / 24 page Data Sheet AD5270/AD5271 Rev. F | Page 9 of 24 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 8. Parameter Rating VDD to GND –0.3 V to +7.0 V VSS to GND +0.3 V to −7.0 V VDD to VSS 7 V VA, VW to GND VSS − 0.3 V, VDD + 0.3 V Digital Input and Output Voltage to GND −0.3 V to VDD + 0.3 V EXT_CAP to VSS 7 V IA, IW Continuous RAW = 20 kΩ ±3 mA RAW = 50 kΩ, 100 kΩ ±2 mA Pulsed1 Frequency > 10 kHz ±MCC2/d3 Frequency ≤ 10 kHz ±MCC2/√d3 Operating Temperature Range4 −40°C to +125°C Maximum Junction Temperature (TJ Maximum) 150°C Storage Temperature Range −65°C to +150°C Reflow Soldering Peak Temperature 260°C Time at Peak Temperature 20 sec to 40 sec Package Power Dissipation (TJ max − TA)/θJA 1 Maximum terminal current is bounded by the maximum current handling of the switches, maximum power dissipation of the package, and maximum applied voltage across any two of the A and W terminals at a given resistance. 2 Maximum continuous current. 3 Pulse duty factor. 4 Includes programming of 50-TP memory. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is defined by JEDEC specification JESD-51 and the value is dependent on the test board and test environment. Table 9. Thermal Resistance Package Type θJA1 θJC Unit 10-Lead LFCSP 50 3 °C/W 10-Lead MSOP 135 N/A °C/W 1 JEDEC 2S2P test board, still air (0 m/s air flow). ESD CAUTION |
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