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LM2931S-5.0 Datasheet(PDF) 4 Page - Texas Instruments |
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LM2931S-5.0 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 29 page LM2931-N SNOSBE5G – MARCH 2000 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) Input Voltage Operating Range 26V Overvoltage Protection LM2931A, LM2931C (Adjustable) 60V LM2931-N 50V Internal Power Dissipation (3) (4) Internally Limited Operating Ambient Temperature Range −40°C to +85°C Maximum Junction Temperature 125°C Storage Temperature Range −65°C to +150°C Lead Temp. (Soldering, 10 seconds) 230°C ESD Tolerance (5) 2000V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device beyond its rated operating conditions. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used. (4) The maximum power dissipation is a function of maximum junction temperature TJmax, total thermal resistance θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2931-N will go into thermal shutdown. For the LM2931-N in the TO-92 package, θJA is 195°C/W; in the SOIC-8 package, θJA is 160°C/W, and in the TO-220 package, θJA is 50°C/W; in the DDPAK/TO-263 package, θJA is 73°C/W; and in the 6-Bump DSBGA package θJA is 290°C/W. If the TO-220 package is used with a heat sink, θJA is the sum of the package thermal resistance junction-to-case of 3°C/W and the thermal resistance added by the heat sink and thermal interface.If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. (5) Human body model, 100 pF discharged through 1.5 k Ω. ELECTRICAL CHARACTERISTICS FOR FIXED 3.3V VERSION VIN = 14V, IO = 10mA, TJ = 25°C, C2 = 100μF (unless otherwise specified) (1) LM2931-N-3.3 Parameter Conditions Units Limit Typ (2) Output Voltage 3.3 3.465 VMAX 3.135 VMIN 4V ≤ VIN ≤ 26V, IO = 100 mA 3.630 VMAX −40°C ≤ TJ ≤ 125°C 2.970 VMIN Line Regulation 4V ≤ VIN ≤ 26V 4 33 mVMAX Load Regulation 5mA ≤ IO ≤ 100mA 10 50 mVMAX Output Impedance 100mADC and 10mArms, 200 m Ω 100Hz - 10kHz Quiescent Current IO ≤ 10mA, 4V ≤ VIN ≤ 26V 0.4 1.0 mAMAX −40°C ≤ TJ ≤ 125°C IO = 100mA, VIN = 14V, TJ = 25°C 15 mA Output Noise Voltage 10Hz -100kHz, COUT = 100μF 330 μVrms Long Term Stability 13 mV/1000 hr Ripple Rejection fO = 120Hz 80 dB (1) See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used. (2) All limits are specified for TJ = 25°C (standard type face) or over the full operating junction temperature range of −40°C to +125°C (bold type face). 4 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2931-N |
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