 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
TPS65023BRSBT Datasheet(PDF) 2 Page - Texas Instruments |
|
|
||||||||||||||||||||||||||||||
TPS65023BRSBT Datasheet(HTML) 2 Page - Texas Instruments |
|
|
2 / 55 page  TPS65023, TPS65023B SLVS670J – JUNE 2006 – REVISED SEPTEMBER 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION(1) TA PACKAGE PART NUMBER(2) –40°C to 85°C 40 pin QFN (RSB) TPS65023RSB –40°C to 85°C 40 pin QFN (RSB) TPS65023BRSB (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. (2) The RSB package is available in tape and reel. Add the R suffix (TPS65023RSBR, TPS65023BRSBR) to order quantities of 3000 parts per reel. Add the T suffix (TPS65023RSBT; TPS65023BRSBT) to order quantities of 250 parts per reel. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT MIN MAX VI Input voltage range on all pins except AGND and PGND pins with respect to –0.3 7 V AGND Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3, 2000 mA PGND3 Peak current at all other pins 1000 mA Continuous total power dissipation See Thermal Information Table TA Operating free-air temperature –40 85 °C TJ Maximum junction temperature 125 °C Ts Storage temperature –65 150 °C tg (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability THERMAL INFORMATION TPS65023 THERMAL METRIC(1) RSB UNITS 40 PINS θJA Junction-to-ambient thermal resistance 32.7 θJCtop Junction-to-case (top) thermal resistance 15.3 θJB Junction-to-board thermal resistance 13.6 °C/W ψJT Junction-to-top characterization parameter 0.1 ψJB Junction-to-board characterization parameter 5.4 θJCbot Junction-to-case (bottom) thermal resistance 1.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s) :TPS65023 TPS65023B |
Similar Part No. - TPS65023BRSBT |
|
Similar Description - TPS65023BRSBT |
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.NET |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
