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HSMP-389T Datasheet(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED |
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HSMP-389T Datasheet(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED |
9 / 13 page 9 Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C) Reflow Parameter Lead-Free Assembly Averageramp-uprate(LiquidusTemperature(T S(max)toPeak) 3°C/secondmax Preheat TemperatureMin(T S(min)) 150°C TemperatureMax(T S(max)) 200°C Time(mintomax)(t S) 60-180seconds Ts(max)toTLRamp-upRate 3°C/secondmax Timemaintainedabove: Temperature(T L) 217°C Time(t L) 60-150seconds PeakTemperature(T P) 260+0/-5°C Timewithin5°CofactualPeaktemperature(t P) 20-40seconds Ramp-downRate 6°C/secondmax Time25°CtoPeakTemperature 8minutesmax Note1:Alltemperaturesrefertotopsideofthepackage,measuredonthepackagebodysurface 25 Time Tp T L tp tL t 25 ° C to Peak Ramp-up ts Ts min Ramp-down Preheat Critical Zone T L to Tp Ts max Figure 26. Surface Mount Assembly Profile. SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g.,IRorvaporphasereflow,wavesoldering,etc.)cir- cuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermalmassofcomponents.Componentswithalow mass,suchastheSOTpackage,willreachsolderreflow temperaturesfasterthanthosewithagreatermass. AvagoTechnologies’diodeshavebeenqualifiedtothe time-temperatureprofileshowninFigure26.Thisprofile isrepresentativeofanIRreflowtypeofsurfacemount assemblyprocess. After ramping up from room temperature, the circuit board with components attached to it (held in place withsolderpaste)passesthroughoneormorepreheat zones.The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature suffi- cientlytoproduceareflowofthesolder. Theratesofchangeoftemperaturefortheramp-upand cool-downzonesarechosentobelowenoughtonot causedeformationoftheboardordamagetocompo- nentsduetothermalshock.Themaximumtemperature inthereflowzone(T MAX)shouldnotexceed260°C. Theseparametersaretypicalforasurfacemountassem- blyprocessforAvagoTechnologiesdiodes.Asageneral guideline,thecircuitboardandcomponentsshouldbe exposedonlytotheminimumtemperaturesandtimes necessarytoachieveauniformreflowofsolder. |
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