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HFBR-5963ALZ Datasheet(PDF) 2 Page - AVAGO TECHNOLOGIES LIMITED |
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HFBR-5963ALZ Datasheet(HTML) 2 Page - AVAGO TECHNOLOGIES LIMITED |
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2 / 14 page  2 Figure 1. Block Diagram DATA OUT SIGNAL DETECT DATA IN QUANTIZER IC LED DRIVER IC PIN PHOTODIODE PRE-AMPLIFIER SUBASSEMBLY LED OPTICAL SUBASSEMBLY DATA OUT DATA IN LC RECEPTACLE R X SUPPLY T X SUPPLY R X GROUND T X GROUND Receiver Section The receiver section of the HFBR-5963xxZ utilizes an InGaAs PIN photodiode coupled to a custom silicon transimpedance preamplifier IC. It is packaged in the optical subassembly portion of the receiver. This PIN/preamplifier combination is coupled to a custom quantizer IC which provides the final pulse shaping for the logic output and the signal detect function. The data output is differential. The data outputisPECLcompatible,ECLreferenced(shifted) to a +3.3 V power supply. The receiver outputs, data output and data out bar, are squelched at signal detect deassert. The signal detect output is single ended. The signal detect circuit works by sensing the level of the received signal and comparing this level to a reference. The SD output is +3.3 V TTL. Package TheoverallpackageconceptfortheAvagotransceiver consists of three basic elements; the two optical subassemblies, an electrical subassembly, and the housing as illustrated in the block diagram in Figure 1. The package outline drawing and pin out are shown in Figures 2 and 5. The details of this package outline and pin out are compliant with the multisource definition of the 2 x 5 DIP. The low profile of the Avago transceiver design complies with the maximum height allowed for the LC connector over the entire length of the package. The optical subassemblies utilize a high-volume assembly process together with low-cost lens elements which result in a cost- effective building block. The electrical subassembly consists of a high volume multilayer printed circuit board on which the ICs and various surface-mounted passive circuit elements are attached. The receiver section includes an internal shield for the electrical and optical subassemblies to ensure high immunity to external EMI fields. The outer housing including the LC ports is molded offillednonconductiveplastictoprovidemechanical strength. The solder posts of the Avago design are isolated from the internal circuit of the transceiver. The transceiver is attached to a printed circuit board with the ten signal pins and the two solder posts which exit the bottom of the housing. The two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with the LC connector fiber cables. |
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