Features

For surface mount applicationsin in or der to optimize

board space

Fast response time: typical less than 1.0ps from 0 volts to

Mechanical Data

Terminals: solderable per MIL-STD-750, Method 2026

Polarity: Color band denotesposit ive end (cathode)

except Bidirectional

Maximum soldering temperature: 260

Maximum Ratings @ 25

Peak Pulse Current on

10/1000us waveform

See Table 1 Note:

2

Peak Pulse Power

Dissipation

1500W

Note:

2

Peak Forward Surge

Current

200A

Note:

4

Operation And Storage

Temperature Range

-55

+1

NOTES:

2. Non-repetitive current pulse, per Fig.3 and derated above

3. Mounted on 8.0mm

4. 8.3ms, single half sine wave duty cycle=4 pulses per. Minute

maximum.

SMCJ1.5KE6.8(C)A

THRU

SMCJ1.5KE550(C)A

Transient

Voltage Suppressor

6.8 to 550 Volts

1500 Watt

Excellent clamping capability

omponents

20736 Marilla Street Chatsworth



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Revision:

D

20

13/01/01

DIMENSIONS

INCHES

MM

DIM

MIN

MAX

MIN

MAX

NOTE

A

.079

.103

2.00

2.62

B

.108

.128

2.75

3.25

C

.002

.008

0.051

0.203

D

.006

.012

0.152

0.305

E

.030

.050

0.76

1.27

F

..305

.320

7.75

8.13

G

.260

.280

6.60

7.11

H

.220

.245

5.59

6.22

0.070”

0.190

0.125”

SUGGESTED SOLDER

PAD LAYOUT

G

H

E

D

F

Epoxy meets UL 94 V-0 flammability rating

Moisture Sensitivity Level 1

Typical Thermal

Resistance Junction

15

A

B

C

DO-214AB

(SMCJ) (LEAD FRAME)

UL Recognized File # E331408

1 of 5

Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

Compliant. See ordering information)

3

1.

High Temperature Solder Exemptions Applied, see EU Directive Annex 7.

1.

High Temperature Solder Exemptions Applied, see EU Directive Annex 7.

to Lead

Typical Thermal

Resistance Junction

75

to Ambient

MCC

TM

Micro Commercial Components

•

Halogen free available upon request by adding suffix "-HF"

Low inductance

•

•

•

•

Low profile package

•

•

•