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TMP175AIDRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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TMP175AIDRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 20 page TMP175 TMP75 SBOS288J − JANUARY 2004 − REVISED DECEMBER 2007 www.ti.com 2 ABSOLUTE MAXIMUM RATINGS(1) Power Supply, V+ 7.0V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input Voltage(2) −0.5V to 7.0V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input Current 10mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Temperature Range −55 °C to +127°C . . . . . . . . . . . . . . . Storage Temperature Range −60 °C to +130°C . . . . . . . . . . . . . . . . . Junction Temperature (TJ max) +150 °C . . . . . . . . . . . . . . . . . . . . . . ESD Rating: Human Body Model (HBM) 4000V . . . . . . . . . . . . . . . . . . . . . . . Charged Device Model (CDM) 1000V . . . . . . . . . . . . . . . . . . . . Machine Model (MM) 300V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Input voltage rating applies to all TMP175 and TMP75 input voltages. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING TMP175 SO-8 D TMP175 TMP175 MSOP-8 DGK DABQ TMP75 SO-8 D TMP75 TMP75 MSOP-8 DGK T127 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. PIN ASSIGNMENTS Top View NOTE: Pin 1 is determined by orienting the package marking as indicated in the diagram. SDA SCL ALERT GND V+ A0 A1 A2 1 2 3 4 8 7 6 5 SO−8 TMP175 SDA SCL ALERT GND V+ A0 A1 A2 1 2 3 4 8 7 6 5 MSOP−8 TMP75 SDA SCL ALERT GND V+ A0 A1 A2 1 2 3 4 8 7 6 5 SO−8 TMP75 SDA SCL ALERT GND V+ A0 A1 A2 1 2 3 4 8 7 6 5 MSOP−8 TMP175 |
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