3

FN8108.2

May 7, 2007

X28HC256PIZ-12 (Note)

X28HC256PI-12 RRZ

-40 to +85

28 Ld PDIP (Pb-free)***

E28.6

X28HC256S-12*

X28HC256S-12 RR

120

0 to +70

28 Ld SOIC (300 mils)

MDP0027

X28HC256SZ-12 (Note)

X28HC256S-12 RRZ

0 to +70

28 Ld SOIC (300 mils) (Pb-free)

MDP0027

X28HC256SI-12*

X28HC256SI-12 RR

-40 to +85

28 Ld SOIC (300 mils)

MDP0027

X28HC256SIZ-12 (Note)

X28HC256SI-12 RRZ

-40 to +85

28 Ld SOIC (300 mils) (Pb-free)

MDP0027

X28HC256SM-12*, **

X28HC256SM-12 RR

-55 to +125

28 Ld SOIC (300 mils)

MDP0027

X28HC256D-90

X28HC256D-90 RR

90

0 to +70

28 Ld CERDIP (520 mils)

F28.6

X28HC256DI-90

X28HC256DI-90 RR

-40 to +85

28 Ld CERDIP (520 mils)

F28.6

X28HC256DM-90

X28HC256DM-90 RR

-55 to +125

28 Ld CERDIP (520 mils)

F28.6

X28HC256DMB-90

C X28HC256DMB-90

MIL-STD-883

28 Ld CERDIP (520 mils)

F28.6

X28HC256EM-90

X28HC256EM-90 RR

-55 to +125

32 Ld LCC (458 mils)

X28HC256EMB-90

C X28HC256EMB-90

MIL-STD-883

32 Ld LCC (458 mils)

X28HC256FI-90

X28HC256FI-90 RR

-40 to +85

28 Ld FLATPACK (440 mils)

X28HC256FM-90

X28HC256FM-90 RR

-55 to +125

28 Ld FLATPACK (440 mils)

X28HC256FMB-90

C X28HC256FMB-90

MIL-STD-883

28 Ld FLATPACK (440 mils)

X28HC256J-90*

X28HC256J-90 RR

0 to +70

32 Ld PLCC

N32.45x55

X28HC256JZ-90* (Note)

X28HC256J-90 ZRR

0 to +70

32 Ld PLCC (Pb-free)

N32.45x55

X28HC256JI-90*

X28HC256JI-90 RR

-40 to +85

32 Ld PLCC

N32.45x55

X28HC256JIZ-90* (Note)

X28HC256JI-90 ZRR

-40 to +85

32 Ld PLCC (Pb-free)

N32.45x55

X28HC256JM-90*

X28HC256JM-90 RR

-55 to +125

32 Ld PLCC

N32.45x55

X28HC256KM-90

X28HC256KM-90 RR

-55 to +125

28 Ld PGA

G28.550x650A

X28HC256KMB-90

C X28HC256KMB-90

MIL-STD-883

28 Ld PGA

G28.550x650A

X28HC256P-90

X28HC256P-90 RR

90

0 to +70

28 Ld PDIP

E28.6

X28HC256PZ-90 (Note)

X28HC256P-90 RRZ

0 to +70

28 Ld PDIP (Pb-free)***

E28.6

X28HC256PI-90

X28HC256PI-90 RR

-40 to +85

28 Ld PDIP

E28.6

X28HC256PIZ-90 (Note)

X28HC256PI-90 RRZ

-40 to +85

28 Ld PDIP (Pb-free)**

E28.6

X28HC256S-90*

X28HC256S-90 RR

0 to +70

28 Ld SOIC (300 mils)

MDP0027

X28HC256SI-90*

X28HC256SI-90 RR

-40 to +85

28 Ld SOIC (300 mils)

MDP0027

X28HC256SIZ-90 (Note)

X28HC256SI-90 RRZ

-40 to +85

28 Ld SOIC (300 mils) (Pb-free)

MDP0027

X28HC256SI-20T1

200

-40 to +85

28 Ld SOIC (300 mils) Tape and Reel

MDP0027

*Add "T1" suffix for tape and reel.

**Add "T2" suffix for tape and reel.

***Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate

termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

PART NUMBER

PART MARKING

ACCESS TIME

(ns)

TEMP. RANGE

(°C)

PACKAGE

PKG. DWG. #

X28HC256