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TPS92023D Datasheet(PDF) 3 Page - Texas Instruments |
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TPS92023D Datasheet(HTML) 3 Page - Texas Instruments |
3 / 23 page TPS92023 www.ti.com SLUSBH3 – JUNE 2013 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT VVCC VCC input voltage from a low-impedance source 11.5 18.0 V RRT RT resistor 1 8.666 k Ω RDT DT resistor 3.3 39 CSS SS capacitor 0.01 1 μF THERMAL INFORMATION TPS92023 THERMAL METRIC(1) D (SOIC) UNITS 8 PINS θJA Junction-to-ambient thermal resistance(2) 117.3 θJCtop Junction-to-case (top) thermal resistance(3) 63.4 θJB Junction-to-board thermal resistance(4) 57.5 °C/W ψJT Junction-to-top characterization parameter(5) 15.2 ψJB Junction-to-board characterization parameter(6) 57.0 θJCbot Junction-to-case (bottom) thermal resistance(7) n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Spacer Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TPS92023 |
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