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BU21TD3WG-XTR Datasheet(HTML) 8 Page - Rohm

Part No. BU21TD3WG-XTR
Description  High accuracy detection, low current consumption
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Maker  ROHM [Rohm]
Homepage  http://www.rohm.com
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BU21TD3WG-XTR Datasheet(HTML) 8 Page - Rohm

 
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www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.
TSZ02201-0RBR0A300030-1-2
TSZ22111・15・001
8/9
17.JAN.2013.Rev.001
BUxxTD3WG series
Datasheet
About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the
original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability.
Therefore, be sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage
VOUT: Output voltage
IOUT(MAX): Maximum output current)
Measurement conditions
Standard ROHM Board
Top Layer (Top View)
Layout of Board for
Measurement
IC
Implementation
Position
Bottom Layer (Top View)
Measurement State
With board implemented (Wind speed 0 m/s)
Board Material
Glass epoxy resin (Double-side board)
Board Size
70 mm x 70 mm x 1.6 mm
Top layer
Metal (GND) wiring rate: Approx. 0%
Wiring
Rate
Bottom
layer
Metal (GND) wiring rate: Approx. 50%
Through Hole
Diameter 0.5mm x 6 holes
Power Dissipation
0.54W
Thermal Resistance
θja=185.2°C/W
* Please design the margin so that
PMAX becomes is than Pd (PMAX
<Pd)
within the usage temperature range
Fig. 28
SSOP5
Power dissipation heat reduction characteristics (Reference)
0
0.1
0.2
0.3
0.4
0.5
0.6
0
25
50
75
100
125
Ta [
℃]
0.54W
85
Standard ROHM
Board


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