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PF1206S Series

Slow blow chiP FuSeS

DeScRiPtion

The PF1206S Series are slow blow, high inrush chip fuses that are designed to protect consumer electronics, comput-

ers and telecommincations equipment and devices from the risk of fire or shock caused by over-currents.

The PF1206S Series is available in a rugged ceramic and glass package. These devices have excellent environmental

performance.

FeatuReS

• High Inrush Current Withstanding Capability

• Compatible with Reflow and Wave Solder

• Excellent Environmental Performance

• RoHS & REACH Compliant

• Halogen-Free Material

• Life Test: MIL-STD-202, Method 108D

• Humidity Bias: MIL-STD-202, Method 103

• Moisture Resistance Test: MIL-STD-202, Method 106G

• Thermal Shock: MIL-STD-202, Method 107G

• Terminal Strength: AEC-Q200-006

• Board Flex: AEC-Q200-005

• Vibration: MIL-STD-202, Method 204C

• Mechanical Shock: MIL-STD-202, Method 213C

• Solderability: ANSI/J-STD-002

• Resistance to Solder Heat: MIL-STD-202, Method 210B

• Resistance to Solvents Test: MIL-STD-202, Method 216

aPPlicationS

• Telecommications Equipment - DSL/Cable Modems

• SMART Phones and other Handheld Devices

• Computers - Laptops, Desktops, Servers

• Computer Peripherials - Printers, LCD Panels, Scanners

• Consumer Electronics - DVD Player, MP3/MP4 Players

Mechanical chaRacteRiSticS

• Ceramic and Glass Package

• Approximate Weight: 0.009 grams

• Lead-Free

• Soldering Method

Wave Soldering: 260°C, 10s Max

Reflow Soldering: 260°C, 30s Max

electRical chaRacteRiSticS

aMPeRe Rating

% oF aMP Rating

oPening tiMe

1A-7A

100%

4 Hours Minimum

1A-7A

200%

1 ~ 120 Seconds

1A-7A

300%

0.1 ~ 3 Seconds

1A-7A

800%

0.002 ~ 0.05 Seconds

FuSe