TPS2204A

TPS2206A

TPS2210A

SLVS449A − DECEMBER 2002 − REVISED MAY 2003

www.ti.com

2

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during

storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

PACKAGED DEVICES

TA

PLASTIC SMALL OUTLINE

(DB)

POWERPAD

 PLASTIC SMALL

OUTLINE (DAP−32)

POWERPAD

 PLASTIC SMALL

OUTLINE (PWP−24)

−40

°C to 85°C

TPS2206ADB

TPS2206ADAP

TPS2204APWP

TPS2210APWP

(1) The DB, PWP, and DAP packages are available taped and reeled. Add R suffix to device type (e.g., TPS2206ADBR) for taped and reeled.

PACKAGE DISSIPATION RATINGS

PACKAGE(1)

TA ≤ 25°C

POWER RATING

DERATING FACTOR

ABOVE TA = 25°C

TA = 70°C

POWER RATING

TA = 85°C

POWER RATING

DB (30)

821.46 mW

10.95 mW/

°C

328.58 mW

164.29 mW

DAP (32)

3191.4 mW

42.55 mW/

°C

1276.5 mW

638.29 mW

PWP (24)

2491.6 mW

33.22 mW/

°C

996.67 mW

498.33 mW

(1) These devices are mounted on an JEDEC low-k board (2-oz. traces on surface).

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

UNITS

VI(3.3V)

−0.3 V to 5.5

V

Input voltage range for card power

VI(5V)

−0.3 V to 5.5

V

Input voltage range for card power

VI(12V)

−0.3 V to 14

V

Logic input/output voltage

−0.3 V to 6

V

Output voltage

VO(xVCC)

−0.3 V to 6

V

Output voltage

VO(xVPP)

−0.3 V to 14

V

Continuous total power dissipation

See Dissipation Rating Table

Output current

IO(xVCC)

Internally Limited

Output current

IO(xVPP)

Internally Limited

Operating virtual junction temperature range, TJ

−40

°C to 100

°C

Storage temperature range, TSTG

−55

°C to 150

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds)

260

°C

OC sink current

10

mA

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

PowerPAD is a trademark of Texas Instruments.