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HSMN-A400-S8PM2 Datasheet(PDF) 11 Page - AVAGO TECHNOLOGIES LIMITED |
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HSMN-A400-S8PM2 Datasheet(HTML) 11 Page - AVAGO TECHNOLOGIES LIMITED |
11 / 11 page For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes AV01-0312EN AV02-0479EN - March 20, 2013 Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per JEDEC J-STD-020. Precaution when handling this moisture sensitive product is important to ensure the reliability of the product. Refer to Avago Application Note AN 5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use – Unopen moisture barrier bag (MBB) can be stored at <40°C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. – It is not recommended to open the MBB prior to assembly (e.g., for IQC). B. Control after opening the MBB – The humidity indicator card (HIC) shall be read immediately upon opening of MBB. – The LEDs must be kept at <30°C/60% RH at all times and all high temperature related processes, including soldering, curing or rework, need to be completed within 672 hours. C. Control of unfinished reel – Unused LEDs need to be stored in sealed MBB with desiccant or in desiccator at <5% RH. D. Control of assembled boards – If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB needs to be stored in sealed MBB with desiccant or in desiccator at <5% RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: – “10%” is Not blue and “5%” HIC indicator turns pink. – The LEDs are exposed to conditions of >30°C/60% RH at any time. – The LEDs' floor life exceeds 672 hours. Recommended baking conditions: 60±5°C for 20 hours. Handling Precautions The encapsulation material of the InGaN family product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. |
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