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HFBR-5208M Datasheet(PDF) 6 Page - AVAGO TECHNOLOGIES LIMITED |
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HFBR-5208M Datasheet(HTML) 6 Page - AVAGO TECHNOLOGIES LIMITED |
6 / 20 page 6 ) MAX. +0.1 -0.05 +0.004 -0.002 0.25 (0.010 3.3 ± 0.38 (0.130 ± 0.015) 9.8 (0.386) 0.51 (0.020) 39.6 (1.56) MAX. MAX. SLOT DEPTH XXXX-XXXX ZZZZZ LASER PROD 21CFR(J) CLASS 1 COUNTRY OF ORIGIN YYWW TX RX SLOT WIDTH KEY: YYWW = DATE CODE XXXX-XXXX = HFBR-5208M or HFCT-5208M ZZZZ = 1300 nm 12.7 (0.50) 25.4 (1.00) 2.5 (0.10) 4.7 (0.185) 2.0 ± 0.1 (0.079 ± 0.004) 12.7 (0.50) AREA RESERVED FOR PROCESS PLUG N.B. For shielded module the label is mounted on the end as shown. 8X ) 9X Ø 2X Ø ) 2X Ø +0.25 -0.05 +0.010 -0.002 0.46 (0.018 23.8 (0.937) 20.32 (0.800) 2.54 (0.100) 1.3 (0.051) 20.32 (0.800) 20.32 (0.800) 15.8 ± 0.15 (0.622 ± 0.006) +0.25 -0.05 +0.010 -0.002 1.27 (0.050 14.5 (0.57) Masked insulator material (no metalization) DIMENSIONS ARE IN MILLIMETERS (INCHES). TOLERANCES: X.XX ±0.025 mm X.X ±0.05 mm UNLESS OTHERWISE SPECIFIED. Both shielded design options connect only to the equipment chassis and not to the signal or logic ground of the circuit board within the equipment closure. The front panel aperture dimensions are recommended in Figures 9 and 11. When layout of the printed circuit board is done to incorporate these metal-shielded transceivers, keep the area on the printed circuit board directly under the external metal shield free of any components and circuit board traces. For additional EMI performance advantage, use duplex SC fiber-optic connectors that have low metal content inside the connector. This lowers the ability of the metal fiber-optic connectors to couple EMI out through the aperture of the panel or enclosure. Recommended Solder and Wash Process The HFBR/HFCT-5208M is compatible with industry- standard wave or hand solder processes. HFBR-5000 Process Plug The HFBR/HFCT-5208M transceiver is supplied with a process plug, the HFBR-5000, for protection of the optical ports with the Duplex SC connector receptacle. This process plug prevents contamination during wave solder and aqueous rinse as well as during handling, shipping or storage. It is made of high-temperature, molded, sealing material that will withstand +85°C and a rinse pressure of 110 lb/in2. Figure 7. Package Outline Drawing for HFBR/HFCT-5208M |
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Similar Description - HFBR-5208M |
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