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ARS1024 Datasheet(PDF) 9 Page - Panasonic Semiconductor |
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ARS1024 Datasheet(HTML) 9 Page - Panasonic Semiconductor |
9 / 12 page Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ RS (ARS) ASCTB106E 201202-T NOTES 1. Coil operating power Pure DC current should be applied to the coil. The wave form should be rectangular. If it includes ripple, the ripple factor should be less than 5%. However, check it with the actual circuit since the characteristics may be slightly different. The nominal operating voltage should be applied to the coil for more than 30 ms to set/reset the latching type relay. 2. Coil connection When connecting coils, refer to the wiring diagram to prevent mis-operation or malfunction. 3. External magnetic field Since RS relays are highly sensitive polarized relays, their characteristics will be affected by a strong external magnetic field. Avoid using the relay under that condition. 4. Cleaning For automatic cleaning, the boiling method is recommended. Avoid ultrasonic cleaning which subjects the relays to high frequency vibrations, which may cause the contacts to stick. It is recommended that alcoholic solvents be used. 5. Conditions for operation, transport and storage conditions 1) Temperature • Single side stable standard and latching type: –40 to 70 °C –40 to 158°F • Single side stable silent type: –40 to 60 °C –40 to 140°F 2) Humidity: 5 to 85% RH (Avoid freezing and condensation.) The humidity range varies with the temperature. Use within the range indicated in the graph below. 3) Atmospheric pressure: 86 to 106 kPa Temperature and humidity range for usage, transport, and storage: Single side stable standard and latching type Single side stable silent type 4) Condensation Condensation forms when there is a sudden change in temperature under high temperature and high humidity conditions. Condensation will cause deterioration of the relay insulation. 5) Freezing Condensation or other moisture may freeze on the relay when the temperature is lower than 0 °C 32°F. This causes problems such as sticking of movable parts or operational time lags. 6) Low temperature, low humidity environments The plastic becomes brittle if the relay is exposed to a low temperature, low humidity environment for long periods of time. 7) Storage requirements Since the relay is sensitive to humidity, the surface-mount type is packaged with tightly sealed anti-humidity packaging. However, when storing, please be careful of the following. (1) Please use promptly once the anti- humidity pack is opened. If relays are left as is after unpacking, they will absorb moisture which will result in loss of air tightness as a result of case expansion due to thermal stress when reflow soldering during the mounting process. (within one day, 30 °C and 60%R.H or less) (2) When storing for a log period after opening the anti-humidity pack, storage in anti-humidity packaging with an anti- humidity bag to which silica gel has been added, is recommended. *Furthermore, if the relay is solder mounted when it has been subjected to excessive humidity, cracks and leaks can occur. Be sure to mount the relay under the required mounting conditions. 6. Soldering 1) Please meet the following conditions if this relay is to be automatically soldered. (1) Preheating: Max. 120 °C 248°F (terminal solder surface) for max. 120 seconds (2) Soldering: Max. 260 ±5°C 500±9°F for max. 6 seconds *Relays are influenced by the type of PC board used. Please confirm with the actual PC board you plan to use. *Please avoid reflow soldering. 2) Surface-mount terminal In case of automatic soldering, the following conditions should be observed (1) Position of measuring temperature (2) IR (infrared reflow) soldering method • Mounting cautions Rise in relay temperature depends greatly on the component mix on a given PC board and the heating method of the reflow equipment. Therefore, please test beforehand using actual equipment to ensure that the temperature where the relay terminals are soldered and the temperature at the top of the relay case are within the conditions given above. 3) Please meet the following conditions if this relay is to be soldered by hand. (1) 260 °C 500°F for max. 10 seconds (2) 350 °C 662°F for max. 3 seconds The effect on the relay depends on the actual substrate used. Please verify the substrate to be used. (3) Avoid ultrasonic cleaning. Doing so will adversely affect relay characteristics. Please use alcohol-based cleaning solvents when cleaning relays. 7. Tape and reel packing 1) Tape dimensions 2) Dimensions of plastic reel Humidity, %R.H. Temperature, °C °F Tolerance range 85 5 070 -40 32 158 -40 (Avoid condensation when used at temperatures higher than 0 °C 32°F) (Avoid freezing when used at temperatures lower than 0 °C 32°F) Humidity, %R.H. Temperature, °C °F Tolerance range 85 5 060 -40 32 140 -40 (Avoid condensation when used at temperatures higher than 0 °C 32°F) (Avoid freezing when used at temperatures lower than 0 °C 32°F) A A: Surface of PC board where relay is mounted. T1 T2 T3 t1 t2 T1=150 to 180 °C T2=230 °C and higher T3=250 °C max. t1=60s to 120s t2=within 30s 8.6 .339 8.3 .327 Relay polarity bar RS relay .630 16.0 .079 2.0 0.4 .016 4.0 .157 Tape coming out direction Z type X type (General tolerance: ±0.1 ±.004) .472 12.0 24.0 ±0.3 .945 ±.012 .069 1.75 11.5 .453 15.00 .591 dia. .059 +.004 0 dia. 1.5 +0.1 0 ±0.2 24.4 +2.0 0 .961 +.079 0 2.0 ±.008 .079 13 dia. ±0.2 .512 dia. ±.008 .827 dia. ±.031 21 dia. ±0.8 80 dia. ±1 3.150 dia. ±.039 380 dia. ±2 14.961 dia. ±.079 .079 ±.020 2.0 ±0.5 |
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Similar Description - ARS1024 |
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