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FAN5093MTCX Datasheet(PDF) 11 Page - Fairchild Semiconductor |
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FAN5093MTCX Datasheet(HTML) 11 Page - Fairchild Semiconductor |
11 / 17 page PRODUCT SPECIFICATION FAN5093 REV. 1.1.0 3/27/03 11 Adaptive Delay Gate Drive The FAN5093 embodies an advanced design that ensures minimum MOSFET transition times while eliminating shoot-through current. It senses the state of the MOSFETs and adjusts the gate drive adaptively to ensure that they are never on simultaneously. When the high-side MOSFET turns off, the voltage on its source begins to fall. When the voltage there reaches approximately 2.5V, the low-side MOSFETs gate drive is applied. When the low-side MOSFET turns off, the voltage at the LDRV pin is sensed. When it drops below approximately 2V, the high-side MOSFET’s gate drive is applied. Maximum Duty Cycle In order to ensure that the current-sensing and charge- pumping work, the FAN5093 guarantees that the low-side MOSFET will be on a certain portion of each period. For low frequencies, this occurs as a maximum duty cycle of approxi- mately 90%. Thus at 250KHz, with a period of 4µsec, the low-side will be on at least 4µsec • 10% = 400nsec. At higher frequencies, this time might fall so low as to be ineffective. The FAN5093 guarantees a minimum low-side on-time of approximately 330nsec, regardless of duty cycle. Current Sensing The FAN5093 has two independent current sensors, one for each phase. Current sensing is accomplished by measuring the source-to-drain voltage of the low-side MOSFET during its on-time. Each phase has its own power ground pin, to per- mit the phases to be placed in different locations without affecting measurement accuracy. For best results, it is impor- tant to connect the PGND and SW pins for each phase as a Kelvin trace pair directly to the source and drain, respec- tively, of the appropriate low-side MOSFET. Care is required in the layout of these grounds; see the layout guidelines in this datasheet. Current Sharing The two independent current sensors of the FAN5093 operate with their independent current control loops to guarantee that the two phases each deliver half of the total output current. The only mismatch between the two phases occurs if there is a mismatch between the RDS,on of the low-side MOSFETs. Light Load Efficiency At light load, the FAN5093 uses a number of techniques to improve efficiency. Because a synchronous buck converter is two quadrant, able to both source and sink current, during light load the inductor current will flow away from the out- put and towards the input during a portion of the switching cycle. This reverse current flow is detected by the FAN5093 as a positive voltage appearing on the low-side MOSFET during its on-time. When reverse current flow is detected, the low-side MOSFET is turned off for the rest of the cycle, and the current instead flows through the body diode of the high-side MOSFET, returning the power to the source. This technique substantially enhances light load efficiency. Short Circuit Current Characteristics (ILIM Pin) The FAN5093 short circuit current characteristic includes a function that protects the DC-DC converter from damage in the event of a short circuit. The short circuit limit is set with the RS resistor, as given by the formula with ISC the desired output current limit, RT the oscillator resistor and RDS,on one phase’s low-side MOSFET’s on resistance. Remember to make the RS large enough to include the effects of initial tolerance and temperature varia- tion on the MOSFETs’ RDS,on. Important Note! The oscillator frequency must be selected before selecting the current limit resistor, because the value of RT is used in the calculation of RS. When an overcurrent is detected, the high-side MOSFETs are turned off, and the low-side MOSFETs are turned on, and they remain in this state until the measured current through the low-side MOSFET has returned to zero amps. After reaching zero, the FAN5093 re-soft-starts, ensuring that it can also safely turn on into a short. A limitation on the current sense circuit is that ISC • RDS,on must be less that 375mV. To ensure correct operation, use ISC • RDS,on ≤ 300mV; between 300mV and 375mV, there will be some non-linearity in the short-circuit current not accounted for in the equation. As an example, consider the typical characteristic of the DC-DC converter circuit with two FDP6670AL low-side MOSFETs (RDS = 6.5m Ω maximum at 25°C • 1.2 at 75°C = 7.8m Ω each, or 3.9mΩ total) in each phase, RT = 42.1KΩ (600KHz oscillator) and a 50K Ω RS. The converter exhibits a normal load regulation characteris- tic until the voltage across the MOSFETs exceeds the inter- nal short circuit threshold of 50K Ω/(3.9mΩ • 41.2KΩ • 6.66) = 47A. [Note that this current limit level can be as high as 50K Ω/(3.5mΩ • 41.2KΩ • 6.66) = 52A, if the MOSFETs have typical RDS,on rather than maximum, and are at 25 °C.] At this point, the internal comparator trips and signals the controller to leave on the low-side MOSFETs and keep off the high-side MOSFETs. The inductor current decreases, and power is not applied again until the inductor current reaches 0A and the converter attempts to re-softstart. E*-mode In addition, further enhancement in efficiency can be obtained by putting the FAN5093 into E*-mode. When the Droop pin is pulled to the 5V BYPASS voltage, the “A” phase of the FAN5093 is completly turned off, reducing in half the amount of gate charge power being consumed. E*-mode can be implemented with the circuit shown in Figure 3. R S Ω () I SC R DS on , R T 3.33 • • • = |
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