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AD9601BCPZ-200 Datasheet(PDF) 8 Page - Analog Devices |
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AD9601BCPZ-200 Datasheet(HTML) 8 Page - Analog Devices |
8 / 32 page AD9601 Rev. 0 | Page 8 of 32 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating ELECTRICAL AVDD to AGND −0.3 V to +2.0 V DRVDD to DRGND −0.3 V to +2.0 V AGND to DRGND −0.3 V to +0.3 V AVDD to DRVDD −2.0 V to +2.0 V Dx0 Through Dx9 to DRGND −0.3 V to DRVDD + 0.3 V DCO+/DCO− to DRGND −0.3 V to DRVDD + 0.3 V OVRA/OVRB to DGND −0.3 V to DRVDD + 0.3 V CLK+ to AGND −0.3 V to +3.6 V CLK− to AGND −0.3 V to +3.6 V VIN+ to AGND −0.3 V to AVDD + 0.2 V VIN− to AGND −0.3 V to AVDD + 0.2 V SDIO/DCS to DGND −0.3 V to DRVDD + 0.3 V PDWN to AGND −0.3 V to +3.6 V CSB to AGND −0.3 V to +3.6 V SCLK/DFS to AGND −0.3 V to +3.6 V ENVIRONMENTAL Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering, 10 sec) 300°C Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 6. Package Type θJA θJC Unit 56-Lead LFCSP (CP-56-2) 30.4 2.9 °C/W Typical θJA and θJC are specified for a 4-layer board in still air. Airflow increases heat dissipation, effectively reducing θJA. In addition, metal in direct contact with the package leads from metal traces, and through holes, ground, and power planes reduces the θJA. ESD CAUTION |
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