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BAS16W Datasheet(PDF) 5 Page - NXP Semiconductors

Part # BAS16W
Description  High-speed switching diodes
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

BAS16W Datasheet(HTML) 5 Page - NXP Semiconductors

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BAS16_SER_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 25 August 2008
5 of 20
NXP Semiconductors
BAS16 series
High-speed switching diodes
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB with 60
µm copper strip line.
[3]
Single diode loaded.
[4]
Tj =25 °C prior to surge.
[5]
Reflow soldering is the only recommended soldering method.
[6]
Soldering point of cathode tab.
[7]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[8]
Soldering points at pins 4, 5 and 6.
6.
Thermal characteristics
Per device
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
Table 6.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
BAS16
[1] -
-
500
K/W
BAS16H
[2][3] -
-
330
K/W
[3][4] -
-
150
K/W
BAS16J
[3][4] -
-
230
K/W
BAS16L
[2][3] -
-
500
K/W
BAS16VV
[2][3]
[5]
-
-
700
K/W
[3][4]
[5]
-
-
410
K/W
BAS16W
[1] -
-
625
K/W
Rth(j-t)
thermal resistance from
junction to tie-point
BAS16
-
-
330
K/W
BAS16W
-
-
300
K/W


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