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HCPL-4100 Datasheet(PDF) 3 Page - AVAGO TECHNOLOGIES LIMITED |
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HCPL-4100 Datasheet(HTML) 3 Page - AVAGO TECHNOLOGIES LIMITED |
3 / 12 page 3 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4100) Figure 1. Solder Reflow Thermal Profile. Solder Reflow Thermal Profile 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160°C 140°C 150°C PEAK TEMP. 245°C PEAK TEMP. 240°C PEAK TEMP. 230°C SOLDERING TIME 200°C PREHEATING TIME 150°C, 90 + 30 SEC. 2.5°C ± 0.5°C/SEC. 3°C + 1°C/–0.5°C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3°C + 1°C/–0.5°C/SEC. REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. 0.635 ± 0.25 (0.025 ± 0.010) 12° NOM. 9.65 ± 0.25 (0.380 ± 0.010) 0.635 ± 0.130 (0.025 ± 0.005) 7.62 ± 0.25 (0.300 ± 0.010) 5 6 7 8 4 3 2 1 9.65 ± 0.25 (0.380 ± 0.010) 6.350 ± 0.25 (0.250 ± 0.010) 1.080 ± 0.320 (0.043 ± 0.013) 1.780 (0.070) MAX. 1.19 (0.047) MAX. 2.54 (0.100) BSC 0.254 + 0.076 - 0.051 (0.010 + 0.003) - 0.002) 1.016 (0.040) 1.27 (0.050) 10.9 (0.430) 2.0 (0.080) LAND PATTERN RECOMMENDATION 3.56 ± 0.13 (0.140 ± 0.005) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. Note: Non-halide flux should be used. |
Similar Part No. - HCPL-4100 |
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Similar Description - HCPL-4100 |
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