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IS43DR16320B-25DBL Datasheet(PDF) 1 Page - Integrated Silicon Solution, Inc |
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IS43DR16320B-25DBL Datasheet(HTML) 1 Page - Integrated Silicon Solution, Inc |
1 / 30 page IS43/46DR86400B, IS43/46DR16320B Integrated Silicon Solution, Inc. – www.issi.com – 1 Rev. I, 8/01/2012 512Mb (x8, x16) DDR2 SDRAM AUGUST 2012 FEATURES • Clock frequency up to 400MHz • Posted CAS • Programmable CAS Latency: 3, 4, 5 and 6 • Programmable Additive Latency: 0, 1, 2, 3, 4 and 5 • Write Latency = Read Latency-1 • Programmable Burst Sequence: Sequential or Interleave • Programmable Burst Length: 4 and 8 • Automatic and Controlled Precharge Command • Power Down Mode • Auto Refresh and Self Refresh • Refresh Interval: 7.8 µs (8192 cycles/64 ms) • OCD (Off-Chip Driver Impedance Adjustment) • ODT (On-Die Termination) • Weak Strength Data-Output Driver Option • Bidirectional differential Data Strobe (Single- ended data-strobe is an optional feature) • On-Chip DLL aligns DQ and DQs transitions with CK transitions • Differential clock inputs CK and CK# • VDD and VDDQ = 1.8V ± 0.1V • PASR (Partial Array Self Refresh) • SSTL_18 interface • tRAS lockout supported • Read Data Strobe supported (x8 only) • Internal four bank operations with single pulsed RAS • Operating temperature: Commercial (TA = 0°C to +70°C ; TC = 0°C to +85°C) Industrial (TA = -40°C to +85°C; TC = -40°C to +95°C) Automotive, A1 (TA = -40°C to +85°C; TC = -40°C to +95°C) Automotive, A2 (TA = -40°C to +105°C; TC = -40°C to +105°C) OPTIONS • Configuration: − 64Mx8 (16M x 8 x 4 banks) − 32Mx16 (8M x 16 x 4 banks) • Package: − 60-ball TW-BGA for x8 − 84-ball TW-BGA for x16 ADDRESS TABLE Parameter 64Mx8 32Mx16 Row Addressing A0-A13 A0-A12 Column Addressing A0-A9 A0-A9 Bank Addressing BA0-BA1 BA0-BA1 Precharge Addressing A10 A10 Clock Cycle Timing -5B -37C -3D -25E -25D Units Speed Grade DDR2-400B DDR2-533C DDR2-667D DDR2-800E DDR2-800D CL-tRCD-tRP 3-3-3 4-4-4 5-5-5 6-6-6 5-5-5 tCK tCK (CL=3) 5 5 5 5 5 ns tCK (CL=4) 5 3.75 3.75 3.75 3.75 ns tCK (CL=5) 5 3.75 3 3 2.5 ns tCK (CL=6) 5 3.75 3 2.5 2.5 ns Frequency (max) 200 266 333 400 400 MHz Note: The -5B device specification is shown for reference only. Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances |
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