5

Reflow Soldering Profile

The recommended reflow soldering conditions are per JEDEC Standard J-STD-020 (latest revision). Non-halide flux

should be used.

Regulatory Information

The ACPL-061L, ACPL-064L, ACPL-M61L, ACPL-W61L and ACPL-K64L are pending approval by the following organizations:

IEC/EN/DIN EN 60747-5-5 (Option 060 only)

UL

CSA

Approval under CSA Component Acceptance Notice #5, File CA 88324.

Insulation and Safety Related Specifications

Parameter

Symbol

ACPL-061L

ACPL-064L

ACPL-M61L

ACPL-W61L

ACPL-K64L

Units

Conditions

Minimum External

Air Gap

(External Clearance)

L(101)

4.9

5

8

mm

Measured from input terminals to

output terminals, shortest distance

through air.

Minimum External

Tracking

(External Creepage)

L(102)

4.8

5

8

mm

Measured from input terminals to

output terminals, shortest distance

path along body.

Minimum Internal

Plastic Gap

(Internal Clearance)

0.08

0.08

0.08

mm

Through insulation distance

conductor to conductor, usually

the straight line distance thickness

between the emitter and detector.

Tracking Resistance

(Comparative Tracking

Index)

CTI

175

175

175

V

DIN IEC 112/VDE 0303 Part 1

Isolation Group

IIIa

IIIa

IIIa

Material Group

(DIN VDE 0110, 1/89, Table 1)