TPS62150, TPS62150A

TPS62151, TPS62152, TPS62153

SLVSAL5B – NOVEMBER 2011 – REVISED JUNE 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

OUTPUT VOLTAGE

PACKAGE

ORDERING

PACKAGE MARKING

adjustable

TPS62150

TPS62150RGT

QUA

adjustable

TPS62150ARGT

PA8I

-40°C to 85°C

1.8 V

TPS62151

16-Pin QFN

TPS62151RGT

QWO

3.3 V

TPS62152

TPS62152RGT

QWP

5.0 V

TPS62153

TPS62153RGT

QWQ

(1)

For detailed ordering information please check the PACKAGE OPTION ADDENDUM section at the end of this datasheet.

(2)

Contact the factory to check availability of other fixed output voltage versions.

(3)

While TPS6215X has PG=High Z, TPS62150A features PG=Low, when device is in shutdown through EN, UVLO or Thermal Shutdown.

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

AVIN, PVIN

-0.3

20

V

EN, SS/TR

-0.3

SW

-0.3

V

DEF, FSW, FB, PG, VOS

-0.3

7

V

Power Good sink current PG

10

mA

-40

125

Temperature range

°C

-65

150

HBM Human body model

2

kV

CDM Charge device model

0.5

kV

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to network ground terminal.

(3)

ESD testing is performed according to the respective JESD22 JEDEC standard.

THERMAL INFORMATION

TPS6215X

UNITS

RGT 16 PINS

Junction-to-ambient thermal resistance

29.1

Junction-to-case(top) thermal resistance

15

Junction-to-board thermal resistance

11

°C/W

Junction-to-top characterization parameter

0.5

Junction-to-board characterization parameter

10

Junction-to-case(bottom) thermal resistance

3.5

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

3

17

V

–40

85

°C

–40

125

°C

2

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