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HUFA75631SK8 Datasheet(PDF) 6 Page - Fairchild Semiconductor |
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HUFA75631SK8 Datasheet(HTML) 6 Page - Fairchild Semiconductor |
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6 / 11 page  ©2001 Fairchild Semiconductor Corporation HUFA75631SK8 Rev. B Thermal Resistance vs. Mounting Pad Area The maximum rated junction temperature, TJM, and the thermal resistance of the heat dissipating path determines the maximum allowable device power dissipation, PDM, in an application. Therefore the application’s ambient temperature, TA ( oC), and thermal resistance RθJA (oC/W) must be reviewed to ensure that TJM is never exceeded. Equation 1 mathematically represents the relationship and serves as the basis for establishing the rating of the part. In using surface mount devices such as the SOP-8 package, the environment in which it is applied will have a significant influence on the part’s current and maximum power dissipation ratings. Precise determination of PDM is complex and influenced by many factors: 1. Mounting pad area onto which the device is attached and whether there is copper on one side or both sides of the board. 2. The number of copper layers and the thickness of the board. 3. The use of external heat sinks. 4. The use of thermal vias. 5. Air flow and board orientation. 6. For non steady state applications, the pulse width, the duty cycle and the transient thermal response of the part, the board and the environment they are in. Fairchild provides thermal information to assist the designer’s preliminary application evaluation. Figure 20 defines the RθJA for the device as a function of the top copper (component side) area. This is for a horizontally positioned FR-4 board with 1oz copper after 1000 seconds of steady state power with no air flow. This graph provides the necessary information for calculation of the steady state FIGURE 16. GATE CHARGE TEST CIRCUIT FIGURE 17. GATE CHARGE WAVEFORMS FIGURE 18. SWITCHING TIME TEST CIRCUIT FIGURE 19. SWITCHING TIME WAVEFORM Test Circuits and Waveforms (Continued) RL VGS + - VDS VDD DUT Ig(REF) VDD Qg(TH) VGS = 2V Qg(10) VGS = 10V Qg(TOT) VGS = 20V VDS VGS Ig(REF) 0 0 Qgs Qgd VGS RL RGS DUT + - VDD VDS VGS tON td(ON) tr 90% 10% VDS 90% 10% tf td(OFF) tOFF 90% 50% 50% 10% PULSE WIDTH VGS 0 0 (EQ. 1) P DM T JM T A – () ZθJA ------------------------------- = HUFA75631SK8 |
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