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HS9-26C32RH-8 Datasheet(PDF) 4 Page - Intersil Corporation |
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HS9-26C32RH-8 Datasheet(HTML) 4 Page - Intersil Corporation |
4 / 4 page HS-26C32RH, HS-26C32EH 4 FN3402.5 May 28, 2013 Die Characteristics DIE DIMENSIONS: 78 mils x 123 mils (1970µm x 3120µm) INTERFACE MATERIALS: Glassivation: Type: SiO2 Thickness: 10k Å ± 1kÅ Top Metallization: M1: Mo/Tiw Thickness: 5800 Å M2: Al/Si/Cu Thickness: 5800 Å Worst Case Current Density: <2.0 x 105A/cm2 Bond Pad Size: 110µm x 100µm Metallization Mask Layout HS-26C32RH, HS-26C32EH AIN VDD BIN AIN (2) AOUT (3) ENAB (4) COUT (5) CIN (6) (8) (9) (14) BIN (13) BOUT (12) ENAB (11) DOUT (10) DIN (1) (16) (15) (7) CIN GND DIN |
Similar Part No. - HS9-26C32RH-8 |
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Similar Description - HS9-26C32RH-8 |
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