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EPM3128A Datasheet(PDF) 97 Page - Altera Corporation |
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EPM3128A Datasheet(HTML) 97 Page - Altera Corporation |
97 / 182 page Package Information Datasheet for Mature Altera Devices 97 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 324-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—Option 1 ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAG-1 Lead Coplanarity 0.008 inches (0.20mm) Weight 1.4 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Symbol Millimeters Min. Nom. Max. A — — 2.20 A1 0.30 — — A2 — — 1.80 A3 0.70 REF D 19.00 BSC E 19.00 BSC b 0.50 0.60 0.70 e 1.00 BSC |
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