SN65HVD101

SN65HVD102

SLLSE84A – MAY 2011 – REVISED MARCH 2013

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Table 5. Temperature Indicator Function

Internal Temperature

Overtemp (Internal)

TEMP_OK

Comment

not overtemp

Z

Normal operation

not overtemp

L

Temperature warning

overtemp disable

L

Overtemp disable

not overtemp

L

Temperature recovery

Table 6. Power Supply Indicator Function

PWR_OK

Comment

L

Both supplies too low

L

L

Z

Both supplies correct

THERMAL INFORMATION

SN65HVD10x

RGB PACKAGE

UNITS

20 PINS

Junction-to-ambient thermal resistance

33.8

Junction-to-case (top) thermal resistance

36.6

Junction-to-board thermal resistance

10.3

°C/W

Junction-to-top characterization parameter

0.4

Junction-to-board characterization parameter

10.3

Junction-to-case (bottom) thermal resistance

2.3

Storage temperature

65 to 150

°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

Line voltage – steady state

–40

V

L+, CQ

Line Voltage – transient, pulse width <100us

+50

V

Supply voltage

–0.3

6

V

V

Input voltage

–0.3

6

V

RX, CUR_OK, WAKE,

Output voltage

–0.3

6

V

PWR_OK

RX, CUR_OK, WAKE,

Output current

TBD

mA

PWR_OK

Tstg

Storage temperature

–65

150

°C

TJ

Die temperature

180

°C

ESD

HBM (all pins)

2

kV

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with reference to the GND pin, unless otherwise specified.

(3)

GND pin and L- line should be at the same DC potential

4

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