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LTC3780EUHPBF Datasheet(PDF) 25 Page - Linear Technology |
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LTC3780EUHPBF Datasheet(HTML) 25 Page - Linear Technology |
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25 / 30 page  LTC3780 25 3780ff For more information www.linear.com/LTC3780 applicaTions inForMaTion • Useimmediateviastoconnectthecomponents(includ- ing the LTC3780’s SGND and PGND pins) to the ground plane.Useseverallargeviasforeachpowercomponent. • Use planes for VIN and VOUT to maintain good voltage filtering and to keep power losses low. • Floodallunusedareasonalllayerswithcopper.Flooding with copper will reduce the temperature rise of power components. Connect the copper areas to any DC net (VIN or GND). • Segregate the signal and power grounds. All small- signal components should return to the SGND pin at one point, which is then tied to the PGND pin close to the sources of switch B and switch C. • Place switch B and switch C as close to the controller as possible, keeping the PGND, BG and SW traces short. • Keep the high dV/dT SW1, SW2, BOOST1, BOOST2, TG1 and TG2 nodes away from sensitive small-signal nodes. • The path formed by switch A, switch B, D1 and the CIN capacitor should have short leads and PC trace lengths. The path formed by switch C, switch D, D2 and the COUT capacitor also should have short leads and PC trace lengths. • The output capacitor (–) terminals should be connected as close as possible the (–) terminals of the input capacitor. • Connect the top driver boost capacitor CA closely to the BOOST1 and SW1 pins. Connect the top driver boost capacitor CB closely to the BOOST2 and SW2 pins. • Connect the input capacitors CIN and output capacitors COUT closely to the power MOSFETs. These capacitors carry the MOSFET AC current in boost and buck mode. • Connect VOSENSE pin resistive dividers to the (+) termi- nals of COUTandsignalground.AsmallVOSENSEbypass capacitormaybeconnectedcloselytotheLTC3780SGND pin. The R2 connection should not be along the high current or noise paths, such as the input capacitors. • RouteSENSE–andSENSE+leadstogetherwithminimum PC trace spacing. Avoid sense lines pass through noisy area, such as switch nodes. The filter capacitor between SENSE+ and SENSE– should be as close as possible to the IC. Ensure accurate current sensing with Kelvin connections at the SENSE resistor. One layout example is shown in Figure 12. • Connect the ITH pin compensation network close to the IC, between ITH and the signal ground pins. The capaci- tor helps to filter the effects of PCB noise and output voltage ripple voltage from the compensation loop. • Connect the INTVCCbypasscapacitor,CVCC,closetothe IC,betweentheINTVCCandthepowergroundpins.This capacitor carries the MOSFET drivers’ current peaks. Anadditional1µFceramiccapacitorplacedimmediately next to the INTVCC and PGND pins can help improve noise performance substantially. |
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