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HSMP-381F-BLKG Datasheet(PDF) 6 Page - AVAGO TECHNOLOGIES LIMITED |
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HSMP-381F-BLKG Datasheet(HTML) 6 Page - AVAGO TECHNOLOGIES LIMITED |
6 / 9 page 6 Assembly Information SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT-323 (SC-70) package is shown in Figure 12 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT-323/-23 package, will reach solder reflow tempera- tures faster than those with a greater mass. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporat- ing solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cool-down zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (T MAX ) should not exceed 260°C. These parameters are typical for a surface mount assembly process for Avago diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. 0.026 0.039 0.079 0.022 Dimensions in inches 0.039 1 0.039 1 0.079 2.0 0.031 0.8 Dimensions in inches mm 0.035 0.9 Figure 12. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323 Products. Figure 13. Recommended PCB Pad Layout for Avago’s SOT-23 Products. SOT-23 PCB Footprint |
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