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5962-91764 Datasheet(PDF) 3 Page - Analog Devices |
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5962-91764 Datasheet(HTML) 3 Page - Analog Devices |
3 / 15 page STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91764 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ VSS to VDD ........................................................................................ -0.3 V dc, +33.0 V dc VSS to VLOGIC................................................................................... -0.3 V dc, +23.5 V dc VSS to DGND..................................................................................... -16. 5 V dc VDD to DGND .................................................................................... +16.5 V dc VLOGIC to DGND ............................................................................... -0.3 V dc, +7.0 V dc VSS to VREFL..................................................................................... -0.3 V dc, VDD – 2.0 V dc VREFH to VDD.................................................................................... +2.0 V dc, +33.0 V dc VREFH to VREFL ................................................................................ 0 V dc, VDD – VSS Current into any pin............................................................................ ±15 mA Digital input voltage to DGND ............................................................ -0.3 V dc, VLOGIC + 0.3 V dc Digital output voltage to DGND .......................................................... -0.3 V dc, +7.0 V dc Power dissipation (PD)....................................................................... 1000 mW 2/ Junction temperature (TJ) .................................................................. +150°C Storage temperature range ................................................................ -65 °C to +150°C Lead temperature (soldering, 60 seconds) ........................................ +300 °C Thermal resistance, junction-to-case ( θJC) ........................................ See MIL-STD-1835 Thermal resistance, junction-to-ambient ( θJA): Case X............................................................................................ 50 °C/W Case 3 ............................................................................................ 70 °C/W 1.4 Recommended operating conditions. Supply voltage range ......................................................................... ±15 V dc Logic supply voltage (VLOGIC)........................................................... +5 V dc Positive reference voltage range (+VREF) ......................................... +2.5 V dc to +10.0 V dc Negative reference voltage range (–VREF)........................................ -10.0 V dc to 0 V dc Ground potential ................................................................................ 0 V dc Ambient operating temperature range (TA)........................................ -55°C to +125°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. ________ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Derate above +80 °C at 14.3 mW/°C for case 3. Derate above +100°C at 20 mW/°C for case X |
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