Datasheet

Datasheet

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TSZ02201-0T2T0AN00010-1-2

© 2013 ROHM Co., Ltd. All rights reserved.

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP2/FP3-C

14.Mar.2013 Rev.003

●Absolute Maximum Ratings（Ta=25°C）

Parameter

Symbol

Ratings

Unit

Supply Voltage

*1

VCC

-0.3 to +50.0

V

Power Dissipation

HTSOP-J8

*2

Pd

0.75

W

TO252-3

*2

Pd

1.3

W

TO263-3F

*2

Pd

1.9

W

SOT223-4F

*2

Pd

0.6

W

Operating Temperature Range

Topr

-40 to +125

°C

Storage Temperature Range

Tstg

-55 to +150

°C

Maximum Junction Temperature

Tjmax

150

°C

*1

Pd should not be exceeded.

*2

HTSOP-J8 mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC. If Ta ≧25 °C, reduce by 6.0 mW/°C.

(1-layer PCB: Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

TO252-3 mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC. If Ta ≧25 °C, reduce by 10.4 mW/°C.

(1-layer PCB: Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

TO263-3F mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC. If Ta ≧25 °C, reduce by 15.3mW/°C.

(1-layer PCB: Copper foil area on the reverse side of PCB:0 mm x 0 mm)

SOT223-4F mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC. If Ta ≧25 °C, reduce by 4.8 mW/°C.

(1-layer PCB: Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

●Operating Conditions（-40 < Ta < +125°C）

■BD733L2EFJ/FP/FP2/FP3-C

Parameter

Symbol

Min.

Max.

Unit

Supply Voltage

*3

VCC

4.37

45.0

V

Startup Voltage

*4

VCC

3.0

-

V

Output Current

IOUT

0

200

mA

■BD750L2EFJ/FP/FP2/FP3-C

Parameter

Symbol

Min.

Max.

Unit

Supply Voltage

*3

VCC

5.8

45.0

V

Startup Voltage

*4

VCC

3.0

-

V

Output Current

IOUT

0

200

mA

*3

For output voltage, refer to the dropout voltage corresponding to the output current.

*4

When IOUT=0mA.