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74ABT125D Datasheet(PDF) 11 Page - NXP Semiconductors |
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74ABT125D Datasheet(HTML) 11 Page - NXP Semiconductors |
11 / 15 page 74ABT125_4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 — 27 April 2010 11 of 15 NXP Semiconductors 74ABT125 Quad buffer; 3-state Fig 13. Package outline SOT762-1 (DHVQFN14) terminal 1 index area 0.5 1 A1 Eh b UNIT y e 0.2 c REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 3.1 2.9 Dh 1.65 1.35 y1 2.6 2.4 1.15 0.85 e1 2 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT762-1 MO-241 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT762-1 DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm A(1) max. A A1 c detail X y y1 C e L Eh Dh e e1 b 26 13 9 8 7 1 14 X D E C B A 02-10-17 03-01-27 terminal 1 index area A C C B v M w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) |
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